AN INTERCONNECT STRUCTURE AND METHOD FOR CONNECTING BURIED SIGNAL LINES TO ELECTRICAL DEVICES
    1.
    发明申请
    AN INTERCONNECT STRUCTURE AND METHOD FOR CONNECTING BURIED SIGNAL LINES TO ELECTRICAL DEVICES 审中-公开
    将连接信号线连接到电气设备的互连结构和方法

    公开(公告)号:WO2005082034A2

    公开(公告)日:2005-09-09

    申请号:PCT/US2005/006021

    申请日:2005-02-24

    Abstract: An electrical component, such as a trace, signal line, or contact pad (202) connected to the trace or signal line, is covered by one or more layers (106, 110). The electrical component is connected directly to an electrical device by forming an opening (114) through the one or more layers (106, 110). The opening (114) exposes a portion of the electrical component. A connector, such as a solder ball (410), a pin contact (618), or a wire bond (502), is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad (412) in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

    Abstract translation: 连接到迹线或信号线的电子部件,例如迹线,信号线或接触焊盘(202)被一个或多个层(106,110)覆盖。 通过形成穿过所述一个或多个层(106,110)的开口(114),所述电气部件直接连接到电气装置。 开口(114)暴露电气部件的一部分。 然后将诸如焊球(410),销触点(618)或引线接合(502)的连接器附接到电气部件的暴露部分。 连接器直接连接到另一个电气设备,以在电气部件和电气设备之间形成电连接。 电气设备可以被配置为例如另一个带状线电路中的第二信号线或接触焊盘(412),微带电路,集成电路或电气部件。

    LIQUID METAL CONTACT MICRORELAY
    2.
    发明申请
    LIQUID METAL CONTACT MICRORELAY 审中-公开
    液体金属接触式微孔

    公开(公告)号:WO2005119721A2

    公开(公告)日:2005-12-15

    申请号:PCT/US2005/018552

    申请日:2005-05-27

    Abstract: Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

    Abstract translation: 可以通过在悬浮在基板上的接触支撑件的端部约束一定量的液态金属来形成液体金属微型继电器。 接触支撑件的移动通常沿着衬底的表面拖动液体金属,并允许液体金属桥接位于衬底上的接触。 共面波导可以用于开关信号而不是微带传输线,以减少由于阻抗变化引起的传输线不连续性。

    LIQUID METAL CONTACT REED RELAY WITH INTEGRATED ELECTROMAGNETIC ACTUATOR
    3.
    发明申请
    LIQUID METAL CONTACT REED RELAY WITH INTEGRATED ELECTROMAGNETIC ACTUATOR 审中-公开
    液体金属接触继电器与集成电磁致动器

    公开(公告)号:WO2005119719A1

    公开(公告)日:2005-12-15

    申请号:PCT/US2005/018741

    申请日:2005-05-27

    CPC classification number: H01P1/127 H01H50/005 H01H2029/008

    Abstract: A miniaturized relay with an integrated electromagnetic actuator allows scaling a reed relay to a small size to reduce the power needed to actuate it while retaining a high quality liquid metal contact. A dragged liquid metal contact is used. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities that occur due to impedance changes.

    Abstract translation: 具有集成电磁执行器的小型化继电器允许将簧片继电器缩放到小尺寸,以减少致动它所需的功率,同时保持高质量的液态金属接触。 使用拖曳的液态金属接触。 共面波导可以用于开关信号而不是微带传输线,以减少由于阻抗变化而发生的传输线不连续性。

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