公开(公告)号：WO2017182272A1

公开(公告)日：2017-10-26

申请号：PCT/EP2017/058119

申请日：2017-04-05

Applicant: AMS AG

Inventor： CHRISTEN, Thomas ,  STEELE, Colin ,  FROEHLICH, Thomas

IPC: H03M3/04 ,  H03M1/12 ,  H03M1/68

Abstract: A signal processing arrangement (100) has a signal input (SI) for connecting a capacitive sensor (CS). An amplifier circuit (AMP) is coupled between the signal input (SI) and a feedback point (CB1). A loop filter (LF) is coupled downstream to the feedback point (CB1). A quantizer (QT) is connected downstream to the loop filter (LF) and provides a multi-bit output word (OW). The multi-bit output word (OW) consists of one or more higher significance bits (HSB) and one or more lower significance bits (LSB). A first feedback path (FB1) is coupled between a quantizer (QT) and the feedback point (CB1) for providing a first feedback signal to the feedback point (CB1) being representative of the one or more lower significance bits (LSB). A second feedback path is coupled to the quantizer (QT) for providing a second feedback signal to the signal input (SI) being representative of the one or more higher significance bits (HSB).

Abstract translation: 信号处理装置（100）具有用于连接电容式传感器（CS）的信号输入（SI）。 放大器电路（AMP）耦合在信号输入端（SI）和反馈点（CB1）之间。 环路滤波器（LF）耦合到反馈点（CB1）的下游。 量化器（QT）连接到环路滤波器（LF）的下游并提供多位输出字（OW）。 多位输出字（OW）由一个或多个较高有效位（HSB）和一个或多个较低有效位（LSB）组成。 第一反馈路径（FB1）耦合在量化器（QT）与反馈点（CB1）之间，用于向表示一个或多个较低有效位（LSB）的反馈点（CB1）提供第一反馈信号。 第二反馈路径耦合到量化器（QT），用于向代表一个或多个较高有效位（HSB）的信号输入（SI）提供第二反馈信号。

公开(公告)号：WO2020064239A1

公开(公告)日：2020-04-02

申请号：PCT/EP2019/072608

申请日：2019-08-23

Applicant: AMS AG

Inventor： STOJANOVIC, Goran ,  STEELE, Colin ,  LOUS, Erik Jan ,  SINGULANI, Anderson

IPC: H04R23/00

Abstract: An integrated optical transducer (2) for detecting dynamic pressure changes comprises a micro - electro - mechanical system, MEMS, die (10) having a MEMS diaphragm (12) with a first side (13) exposed to the dynamic pressure changes and a second side (14). The transducer (2) further comprises an application specific integrated circuit, ASIC, die (11) having an evaluation circuit configured to detect a deflection of the MEMS diaphragm (12), in particular of the second side (14) of the MEMS diaphragm (12). The MEMS die (10) is arranged with respect to the ASIC die (11) such that a gap with a gap height is formed between the second side (14) of the diaphragm (12) and a first surface (19) of the ASIC die (11) and the MEMS diaphragm (12), the ASIC die (11) and a suspension structure (15) of the MEMS die (10) delineate a back volume (4) of the integrated optical transducer (2).

公开(公告)号：WO2021043635A1

公开(公告)日：2021-03-11

申请号：PCT/EP2020/073740

申请日：2020-08-25

Applicant: AMS AG

Inventor： KRAFT, Jochen ,  STERING, Bernhard ,  STEELE, Colin ,  SEURIN, Jean Francois

IPC: G02B6/42

Abstract: A bonded structure (1) comprises a substrate component (20) having a plurality of first pads (21) arranged on or within a surface (22) of the substrate component (20), and an integrated circuit component (10) having a plurality of second pads (11) arranged on or within a surface (12) of the integrated circuit component (10). The bonded structure (1) further comprises a plurality of connection elements (31) physically connecting the first pads (21) to the second pads (11). The surface (12) of the integrated circuit component (10) is tilted obliquely to the surface (22) of the substrate component (22) at a tilt angle (α) that results from nominal variations of surface sizes of the first and second pads (21, 11).

公开(公告)号：WO2020083791A1

公开(公告)日：2020-04-30

申请号：PCT/EP2019/078460

申请日：2019-10-18

Applicant: AMS AG

Inventor： STOJANOVIC, Goran ,  STEELE, Colin ,  MUELLER, Simon ,  FROEHLICH, Thomas

IPC: H04R19/00

Abstract: A sensor includes a substrate; and a corrugated diaphragm offset from the substrate. The corrugated diaphragm is configured to deflect responsive to a sound wave impinging on the corrugated diaphragm. A cavity is defined between the corrugated diaphragm and the substrate, the corrugated diaphragm forming a top surface of the cavity and the substrate forming a bottom surface of the cavity. A pressure in the cavity is lower than a pressure outside of the cavity.

公开(公告)号：WO2020064428A1

公开(公告)日：2020-04-02

申请号：PCT/EP2019/074844

申请日：2019-09-17

Applicant: AMS AG

Inventor： STOJANOVIC, Goran ,  STEELE, Colin ,  MUELLER, Simon ,  FRÖHLICH, Thomas ,  LOUS, Erik Jan ,  SINGULANI, Anderson

IPC: H04R19/00 ,  H04R19/04

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure (10) defining a first cavity (11), and a MEMS microphone (20) arranged inside the first cavity (11). The microphone (20) comprises a first die (21) with bonding structures (23) and a MEMS diaphragm (24), and a second die (22) having an application specific integrated circuit, ASIC. The second die (22) is bonded to the bonding structures (23) such that a gap (28) is formed between a first side (25) of the diaphragm (24) and the second die (22), with the gap (28) defining a second cavity (31). The first side (25) of the diaphragm (24) is interfacing with the second cavity (31) and a second side (26) of the diaphragm (24) is interfacing with the environment (2) via an acoustic inlet port (12) of the enclosure (10). The bonding structures (23) are arranged such that pressure ventilation openings (30) are formed that connect the first cavity (11) and the second cavity (31).