NOTEBOOK COMPUTER WITH HYBRID DIAMOND HEAT SPREADER
    1.
    发明申请
    NOTEBOOK COMPUTER WITH HYBRID DIAMOND HEAT SPREADER 审中-公开
    笔记本电脑与混合金刚石散热器

    公开(公告)号:WO2008150596A3

    公开(公告)日:2009-03-12

    申请号:PCT/US2008061797

    申请日:2008-04-28

    Abstract: Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.

    Abstract translation: 描述设备的实施例。 该装置包括集成电路和耦合到集成电路的散热器。 该散热器包括碳的同素异形体的第一层。 注意,碳的同素异形体具有大致的面心立方晶体结构。 此外,碳的同素异形体具有大于第一预定值的热导率和大于第二预定值的比热。

    SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS
    2.
    发明申请
    SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS 审中-公开
    使用气流分流器冷却电子设备的系统和方法

    公开(公告)号:WO2009088862A3

    公开(公告)日:2010-02-25

    申请号:PCT/US2008088542

    申请日:2008-12-30

    Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.

    Abstract translation: 电子设备可以设置有用于散热的发热部件和冷却模块。 在一些实施例中,冷却部件可以包括构造成产生空气流出的风扇,以及分配器,其不仅构造成在分隔器的第一表面和发热部件之间引导流出物的第一部分,而且还 沿着分隔器的第二表面引导流出物的第二部分。 在其他实施例中,冷却部件可以包括分隔器和压力夹。 压力夹的第一部分可以构造成在分隔器的第一表面上施加压力,使得压力可以保持分隔器的第二表面的一部分与发热部件接触。

    EMBEDDED THERMAL-ELECTRIC COOLING MODULES FOR SURFACE SPREADING OF HEAT
    3.
    发明申请
    EMBEDDED THERMAL-ELECTRIC COOLING MODULES FOR SURFACE SPREADING OF HEAT 审中-公开
    用于表面热膨胀的嵌入式热电冷却模块

    公开(公告)号:WO2008057706A3

    公开(公告)日:2008-07-03

    申请号:PCT/US2007081042

    申请日:2007-10-11

    Inventor: ALI IHAB A

    CPC classification number: G06F1/203

    Abstract: A portable computing device includes a housing having an external surface and an inner surface. A solid-state cooling mechanism in the computing device is coupled to the inner surface. This solid-state cooling mechanism is configured to maintain a temperature difference across at least a portion of the external surface that is less than a pre-determined value.

    Abstract translation: 便携式计算设备包括具有外表面和内表面的外壳。 计算装置中的固态冷却机构联接到内表面。 该固态冷却机构被配置为保持外表面的至少一部分上的温度差小于预定值。

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