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公开(公告)号:WO2019027503A1
公开(公告)日:2019-02-07
申请号:PCT/US2018/015498
申请日:2018-01-26
Applicant: APPLE INC.
Inventor: BALLARD, Lucia E. , HAUCK, Jerrold V. , PRAKASH, Deepti Sunder , TANG, Feng , LITTWIN, Etai , VASU, Pavan Kumar Anasosalu , LITTWIN, Gideon , GERNOTH, Thorsten , KUCEROVA, Lucie , KOSTKA, Petr , HOTELLING, Steve , HIRSH, Eitan , KAITZ, Tal , POKRASS, Jonathan , KOLIN, Andrei , LAIFENFELD, Moshe , WALDON, Matthew C. , MENSCH, Thomas P. , YOUNGS, Lynn , ZELEZNIK, Chris , MALONE, Michael , HENDEL, Ziv , KRSTIC, Ivan , SHARMA, Anup K.
Abstract: Techniques are disclosed relating to biometric authentication, e.g., facial recognition. In some embodiments, a device is configured to verify that image data from a camera unit exhibits a pseudo-random sequence of image capture modes and/or a probing pattern of illumination points (e.g., from lasers in a depth capture mode) before authenticating a user based on recognizing a face in the image data. In some embodiments, a secure circuit may control verification of the sequence and/or the probing pattern. In some embodiments, the secure circuit may verify frame numbers, signatures, and/or nonce values for captured image information. In some embodiments, a device may implement one or more lockout procedures in response to biometric authentication failures. The disclosed techniques may reduce or eliminate the effectiveness of spoofing and/or replay attacks, in some embodiments.
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公开(公告)号:WO2010117882A2
公开(公告)日:2010-10-14
申请号:PCT/US2010/029698
申请日:2010-04-01
Applicant: APPLE INC. , HONG, Sueng, Jae , GRUNTHANER, Martin, Paul , HOTELLING, Steven, Porter , YOUNGS, Lynn
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04111 , G06F2203/04112
Abstract: A touch sensor panel including a plurality of drive lines crossing a plurality of sense lines, forming an array. The plurality of drive lines and the plurality of sense lines are formed by interconnecting sections of at least one conductive material having a truncated diamond shape or formed of interconnected conductive lines. At least one conductive dummy region may be disposed in an area of the touch sensor panel around the truncated diamond shape sections or interconnected conductive lines of the plurality of drive lines and the plurality of sense lines. One or more lines may be formed overlapping the interconnected sections of each of the plurality of drive lines and the plurality of sense lines.
Abstract translation: 触摸传感器面板,包括与多根感测线交叉的多条驱动线,形成阵列。 多个驱动线和多条感测线通过互连具有截头菱形形状或由互连导电线形成的至少一种导电材料的部分而形成。 可以在触摸传感器面板的围绕多个驱动线和多条感测线的截短的菱形形状部分或互连导电线的区域中设置至少一个导电虚拟区域。 可以形成与多个驱动线和多个感测线中的每一个的互连部分重叠的一条或多条线。
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公开(公告)号:WO2010080988A2
公开(公告)日:2010-07-15
申请号:PCT/US2010/020485
申请日:2010-01-08
Applicant: APPLE INC. , CHANG, Shih, Chang , ZHONG, John, Z. , HUANG, Lili , HONG, Seung, Jae , YOUNGS, Lynn
Inventor: CHANG, Shih, Chang , ZHONG, John, Z. , HUANG, Lili , HONG, Seung, Jae , YOUNGS, Lynn
CPC classification number: G06F3/0416 , G06F3/044 , H05K1/0306 , H05K3/0097 , H05K2201/0317 , H05K2201/0326 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156
Abstract: A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.
Abstract translation: 用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。 在一个实施例中,形成两个薄玻璃板的夹层,使得当在制造期间在夹层的表面上执行薄膜处理时,玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。 三明治可能最终分开形成两个薄的SITO / DITO面板。 在另一个实施例中,制造工艺包括层压两个图案化的厚基板,每个基板至少具有现有制造设备的最小厚度公差。 然后层压基板的一个或两个侧面变薄,使得当基板分离时,每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。
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