IMPROVED TOUCH SENSOR PANEL DESIGN
    2.
    发明申请
    IMPROVED TOUCH SENSOR PANEL DESIGN 审中-公开
    改进的TOUCH传感器面板设计

    公开(公告)号:WO2010117882A2

    公开(公告)日:2010-10-14

    申请号:PCT/US2010/029698

    申请日:2010-04-01

    CPC classification number: G06F3/044 G06F2203/04111 G06F2203/04112

    Abstract: A touch sensor panel including a plurality of drive lines crossing a plurality of sense lines, forming an array. The plurality of drive lines and the plurality of sense lines are formed by interconnecting sections of at least one conductive material having a truncated diamond shape or formed of interconnected conductive lines. At least one conductive dummy region may be disposed in an area of the touch sensor panel around the truncated diamond shape sections or interconnected conductive lines of the plurality of drive lines and the plurality of sense lines. One or more lines may be formed overlapping the interconnected sections of each of the plurality of drive lines and the plurality of sense lines.

    Abstract translation: 触摸传感器面板,包括与多根感测线交叉的多条驱动线,形成阵列。 多个驱动线和多条感测线通过互连具有截头菱形形状或由互连导电线形成的至少一种导电材料的部分而形成。 可以在触摸传感器面板的围绕多个驱动线和多条感测线的截短的菱形形状部分或互连导电线的区域中设置至少一个导电虚拟区域。 可以形成与多个驱动线和多个感测线中的每一个的互连部分重叠的一条或多条线。

    A METHOD FOR FABRICATING THIN TOUCH SENSOR PANELS
    3.
    发明申请
    A METHOD FOR FABRICATING THIN TOUCH SENSOR PANELS 审中-公开
    一种制造薄触感传感器面板的方法

    公开(公告)号:WO2010080988A2

    公开(公告)日:2010-07-15

    申请号:PCT/US2010/020485

    申请日:2010-01-08

    Abstract: A method for fabricating thin DITO or SITO touch sensor panels with a thickness less than a minimum thickness tolerance of existing manufacturing equipment. In one embodiment, a sandwich of two thin glass sheets is formed such that the combined thickness of the glass sheets does not drop below the minimum thickness tolerance of existing manufacturing equipment when thin film process is performed on the surfaces of the sandwich during fabrication. The sandwich may eventually be separated to form two thin SITO/DITO panels. In another embodiment, the fabrication process involves laminating two patterned thick substrates, each having at least the minimum thickness tolerance of existing manufacturing equipment. One or both of the sides of the laminated substrates are then thinned so that when the substrates are separated, each is a thin DITO/SITO panel having a thickness less than the minimum thickness tolerance of existing manufacturing equipment.

    Abstract translation: 用于制造厚度小于现有制造设备的最小厚度公差的薄DITO或SITO触摸传感器面板的方法。 在一个实施例中,形成两个薄玻璃板的夹层,使得当在制造期间在夹层的表面上执行薄膜处理时,玻璃板的组合厚度不会下降到现有制造设备的最小厚度公差之下。 三明治可能最终分开形成两个薄的SITO / DITO面板。 在另一个实施例中,制造工艺包括层压两个图案化的厚基板,每个基板至少具有现有制造设备的最小厚度公差。 然后层压基板的一个或两个侧面变薄,使得当基板分离时,每个是具有小于现有制造设备的最小厚度公差的厚度的薄DITO / SITO面板。

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