公开(公告)号：WO2022025959A1

公开(公告)日：2022-02-03

申请号：PCT/US2020/063774

申请日：2020-12-08

Applicant: APPLIED MATERIALS, INC.

Inventor： LO, Kin Pong ,  NAGORNY, Vladimir ,  LIU, Wei ,  GUARINI, Theresa Kramer ,  HWANG, Bernard L. ,  BEVAN, Malcolm J. ,  ABRAHAM, Jacob ,  BEHERA, Swayambhu Prasad

IPC: H01J37/32

Abstract: Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.