公开(公告)号：WO2014151791A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/026455

申请日：2014-03-13

Applicant: APPLIED MATERIALS, INC.

Inventor： ALAGARSAMY, Rajkumar ,  HU, Yongqi ,  YAVELBERG, Simon ,  GOPALAN, Periya ,  MAHON, Christopher R.

IPC: H01L21/304

CPC classification number: B24B37/205 ,  B24B37/22

Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Abstract translation: 抛光制品具有抛光表面和孔，该孔包括第一部分和第二部分。 抛光制品包括向内延伸到孔中的突起。 抛光制品包括在离研磨表面更远的第一表面的一侧的下部。 窗口具有位于孔的第一部分中的第一部分和延伸到孔的第二部分中的第二部分。 窗口具有基本上平行于抛光表面的第二表面。 第一粘合剂将突起的第一表面粘附到窗口的第二表面以将窗口固定到突起，并且将第二粘合剂与不同于第一粘合剂的材料组合物粘合。 第二粘合剂横向定位在窗的第二部分和抛光制品的下部之间。

公开(公告)号：WO2009120641A2

公开(公告)日：2009-10-01

申请号：PCT/US2009/037992

申请日：2009-03-23

Applicant: APPLIED MATERIALS, INC. ,  PAIK, Young, Jeen ,  BARRENTINE, Melvin ,  DESAI, Abhijit, Y. ,  NGUYEN, Hai ,  BHATNAGAR, Ashish ,  ALAGARSAMY, Rajkumar

Inventor： PAIK, Young, Jeen ,  BARRENTINE, Melvin ,  DESAI, Abhijit, Y. ,  NGUYEN, Hai ,  BHATNAGAR, Ashish ,  ALAGARSAMY, Rajkumar

IPC: H01L21/304

CPC classification number: H01L21/6838 ,  B24B37/30 ,  H01L21/0201 ,  H01L21/30625 ,  Y10T428/24355 ,  Y10T428/24612

Abstract: A method and apparatus for planarizing a substrate are provided. A substrate carrier head with an improved cover for holding the substrate securely is provided. The cover may have a bead that is larger than the recess into which it fits, such that the compression forms a conformal seal inside the recess. The bead may also be left uncoated to enhance adhesion of the bead to the surface of the groove. The surface of the cover may be roughened to reduce adhesion of the substrate to the cover without using a non-stick coating.

Abstract translation: 提供了一种用于平坦化基板的方法和装置。 提供了一种具有改进的用于固定基板的盖的基板载体头。 盖可以具有比其配合的凹部大的凸缘，使得压缩在凹部内形成共形密封。 胎圈也可以不涂覆以增强胎圈与沟槽表面的粘附。 盖的表面可以被粗糙化，以减少基材与盖的粘附，而不使用不粘涂层。