公开(公告)号：WO2006031366A2

公开(公告)日：2006-03-23

申请号：PCT/US2005/029357

申请日：2005-08-18

Applicant: APPLIED MATERIALS, INC. ,  GALBURT, Vladimir ,  MAO, Daxin ,  JIA, Renhe ,  WANG, Zhihong ,  TIAN, Yuan ,  LIU, Feng, Q. ,  KO, Sen, Hou ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  HU, Yongqi

Inventor： MAO, Daxin ,  JIA, Renhe ,  WANG, Zhihong ,  TIAN, Yuan ,  LIU, Feng, Q. ,  KO, Sen, Hou ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  HU, Yongqi

CPC classification number: H01L21/7684 ,  B23H5/06 ,  B23H5/08 ,  H01L21/32125

Abstract: A method and apparatus for electrochemically processing metal and barrier materials is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of establishing an electrically-conductive path through an electrolyte between an exposed layer of barrier material on the substrate and an electrode, pressing the substrate against a processing pad assembly with a force less than about 2 psi, providing motion between the substrate and pad assembly in contact therewith and electrochemically removing a portion of the exposed layer during a first electrochemical processing step in a barrier processing station.

Abstract translation: 提供了一种用于电化学处理金属和阻隔材料的方法和装置。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬底上的暴露的阻挡材料层和电极之间建立通过电解质的导电路径，将衬底压靠处理衬垫组件 在约2psi之间提供在与其接触的基板和焊盘组件之间的运动，并且在屏障处理站中的第一电化学处理步骤期间电化学去除暴露层的一部分。

公开(公告)号：WO2005061177A1

公开(公告)日：2005-07-07

申请号：PCT/US2004/037870

申请日：2004-11-12

Applicant: APPLIED MATERIALS, INC. ,  HU, Yongqi ,  TSAI, Stan D. ,  WANG, Yan ,  LIU, Feng Q. ,  CHANG, Shou-Sung ,  CHEN, Liang-Yuh

Inventor： HU, Yongqi ,  TSAI, Stan D. ,  WANG, Yan ,  LIU, Feng Q. ,  CHANG, Shou-Sung ,  CHEN, Liang-Yuh

IPC: B24B37/04

CPC classification number: B24B37/26 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042 ,  B24B37/046 ,  B24B37/22 ,  B24B37/24 ,  B24B49/16 ,  B24B53/017 ,  C25D17/14 ,  H01L21/32125

Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.

Abstract translation: 提供了用于处理衬底的处理衬垫组件的实施例。 处理垫组件包括具有处理表面的上层和具有联接到上层的顶侧和与顶侧相对的底侧的电极。 通过上层形成第一组孔，用于将电极暴露于处理表面。 通过上层和电极形成至少一个孔。

公开(公告)号：WO2005002794A2

公开(公告)日：2005-01-13

申请号：PCT/US2004/022722

申请日：2004-07-01

Applicant: APPLIED MATERIALS, INC. ,  WANG, Yan ,  NEO, Siew, S. ,  LIU, Feng, Q. ,  TSAI, Stan D. ,  HU, Yongqi ,  DUBOUST, Alain ,  MANENS, Antoine, P. ,  WADENSWEILER, Ralph, M. ,  MAVLIV, Rashid ,  CHEN, Liang-Yuh ,  OLGADO, Donald, J.K. ,  BUTTERFIELD, Paul, D. ,  TSENG, Ming-Kuei ,  CHANG, Shou-Sung ,  SUN, Lizhong

Inventor： WANG, Yan ,  NEO, Siew, S. ,  LIU, Feng, Q. ,  TSAI, Stan D. ,  HU, Yongqi ,  DUBOUST, Alain ,  MANENS, Antoine, P. ,  WADENSWEILER, Ralph, M. ,  MAVLIV, Rashid ,  CHEN, Liang-Yuh ,  OLGADO, Donald, J.K. ,  BUTTERFIELD, Paul, D. ,  TSENG, Ming-Kuei ,  CHANG, Shou-Sung ,  SUN, Lizhong

IPC: B24B37/04

CPC classification number: B24B37/04 ,  B23H5/08 ,  B24B53/017 ,  C25F7/00

Abstract: Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical polishing system. In one embodiment, a cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

Abstract translation: 本发明的实施例通常提供一种用于在电化学机械抛光系统中处理衬底的方法和装置。 在一个实施例中，用于抛光衬底的单元包括设置在压板组件的顶表面上的抛光垫。 多个导电元件跨过上抛光表面以间隔的关系布置，并且适于相对于设置在垫和压板组件之间的电极偏置衬底。 多个通道通过压板组件形成在顶表面和限定在压板组件内的气室之间。 在另一个实施例中，提供了具有大量抛光单元和残余抛光单元的系统。 残余抛光单元包括偏置的导电抛光表面。 在另外的实施方案中，保护导电元件免受过程化学物质的侵蚀。

公开(公告)号：WO2018039525A1

公开(公告)日：2018-03-01

申请号：PCT/US2017/048553

申请日：2017-08-25

Applicant: APPLIED MATERIALS, INC.

Inventor： HU, Yongqi ,  TERRY, Thomas Lawrence

IPC: H01L21/304 ,  H01L21/677 ,  H01L21/67

Abstract: A semiconductor fabrication system includes a chemical mechanical polishing system, a cassette holding area enclosed by a wall and having a door openable by an operator to place one or more cassettes into the cassette holding area, a robot configured to transfer substrates between a cassette in the cassette holding area to the chemical mechanical polishing system, a computer controller configured to cause the robot to move to a home position, a circuit breaker in a power supply line to the robot, a door sensor to detect whether the door is open, a robot presence sensor to detect whether the robot is in the home position, and control circuitry configured to receive signals from the door sensor and the robot presence sensor and cause the circuit breaker to cut power to the robot if the door is open and the robot is not in the home position.

Abstract translation: 半导体制造系统包括化学机械抛光系统，由壁包围并且具有可由操作者打开以将一个或多个盒子放入盒子保持区域的门的盒子保持区域，机器人被配置 以在盒子保持区域中的盒子与化学机械抛光系统之间传送基板，配置成使机器人移动到原始位置的计算机控制器，到机器人的电源线路中的断路器，用于检测 门是否打开;机器人存在传感器，检测机器人是否处于原始位置;以及控制电路，配置为接收来自门传感器和机器人存在传感器的信号，并且如果 门打开，机器人不在原位。

公开(公告)号：WO2017065951A1

公开(公告)日：2017-04-20

申请号：PCT/US2016/053180

申请日：2016-09-22

Applicant: APPLIED MATERIALS, INC.

Inventor： SHEELAVANT, Gangadhar ,  YAVELBERG, Simon ,  HU, Yongqi

IPC: B24B37/32 ,  H01L21/304

CPC classification number: B24B37/32

Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.

Abstract translation: 本文描述的实施方式保护用于抛光系统的保持环免受腐蚀性抛光化学品的影响。 在一个实施例中，保持环具有环形主体，该主体具有顶表面，内径侧壁，外径侧壁和底表面。 内径侧壁被配置为外接基板。 所述环形体具有刚性环形部分，聚合物环形部分，所述聚合物环形部分堆叠在所述刚性环形部分上并且覆盖所述刚性环形部分的至少三个侧面，多个凹槽形成在所述底表面中， 以及通过聚合物环形部分形成的多个洗涤端口，其中洗涤端口与刚性环形部分隔离。

公开(公告)号：WO2006093625A1

公开(公告)日：2006-09-08

申请号：PCT/US2006/004114

申请日：2006-02-06

Applicant: APPLIED MATERIALS, INC. ,  HU, Yongqi ,  TSAI, Stan D. ,  WOHLERT, Martin S. ,  LIU, Feng Q. ,  CHEN, Liang-yuh

Inventor： HU, Yongqi ,  TSAI, Stan D. ,  WOHLERT, Martin S. ,  LIU, Feng Q. ,  CHEN, Liang-yuh

IPC: B23H5/08 ,  B24B37/04 ,  H01L21/687

CPC classification number: B24B37/22 ,  B23H5/08 ,  H01L21/67155

Abstract: A method and apparatus for a planarizing or polishing article for Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a pad assembly (122) having a plurality of conductive domains and a plurality of abrasive domains on a processing surface. The abrasive domains and the conductive domains comprise a plurality of contact elements (150) that are adapted to bias a semiconductor substrate (115) while also providing abrasive qualities to enhance removal of material deposited on the substrate.

Abstract translation: 公开了一种用于电化学机械平面化（ECMP）的平面化或抛光制品的方法和装置。 抛光制品是在处理表面上具有多个导电区域和多个研磨区域的垫组件（122）。 研磨区域和导电区域包括适于偏置半导体衬底（115）的多个接触元件（150），同时还提供磨料质量以增强沉积在衬底上的材料的去除。

公开(公告)号：WO2004108358A2

公开(公告)日：2004-12-16

申请号：PCT/US2004/017827

申请日：2004-06-07

Applicant: APPLIED MATERIALS, INC. ,  HU, Yongqi ,  DUBOUST, Alain ,  MANENS, Antoine, P. ,  TSAI, Stan, D. ,  BUTTERFIELD, Paul, D. ,  WANG, Yan ,  LIU, Feng, Q. ,  NEO, Siew, S. ,  CHEN, Liang-Yuh ,  TIAN, Yuan, A. ,  KO, Sen-Hou ,  EWALD, Robert, A.

Inventor： HU, Yongqi ,  DUBOUST, Alain ,  MANENS, Antoine, P. ,  TSAI, Stan, D. ,  BUTTERFIELD, Paul, D. ,  WANG, Yan ,  LIU, Feng, Q. ,  NEO, Siew, S. ,  CHEN, Liang-Yuh ,  TIAN, Yuan, A. ,  KO, Sen-Hou ,  EWALD, Robert, A.

IPC: B24B37/04

CPC classification number: B82Y30/00 ,  B23H5/08 ,  B24B37/205 ,  B24B37/22 ,  C25F7/00

Abstract: Embodiments of a polishing article for processing a substracte are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.

Abstract translation: 提供了用于处理减法器的抛光制品的实施例。 在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层可以是编织的或无纺的。 导电层可以由软质材料组成，并且在一个实施例中，暴露表面可以是平面的。

公开(公告)号：WO2007111729A3

公开(公告)日：2007-10-04

申请号：PCT/US2006/061748

申请日：2006-12-07

Applicant: APPLIED MATERIALS, INC. ,  WANG, You ,  JIA, Renhe ,  TSAI, Stan D. ,  HU, Yongqi ,  WANG, Zhihong ,  DIAO, Jie ,  ALONZO, Gerald John ,  KARUPPIAH, Lakshmanan

Inventor： WANG, You ,  JIA, Renhe ,  TSAI, Stan D. ,  HU, Yongqi ,  WANG, Zhihong ,  DIAO, Jie ,  ALONZO, Gerald John ,  KARUPPIAH, Lakshmanan

IPC: C25F7/00 ,  C25F3/16 ,  C25D5/00 ,  C25D17/00

Abstract: An apparatus and a method with fluid flow assist elements for electrochemical mechanical processing is provided in this invention. In one embodiment, the apparatus includes a first conductive layer having an upper surface adapted to contact a substrate, a second conductive layer disposed below the first conductive layer, an isolation layer disposed between the conductive layers, and a plurality of apertures, each having a first end formed through the first conductive layer and a second end formed through the second conductive layer, wherein the second ends of at least two apertures are laterally coupled by a channel.

公开(公告)号：WO2007019279A2

公开(公告)日：2007-02-15

申请号：PCT/US2006/030381

申请日：2006-08-03

Applicant: APPLIED MATERIALS, INC. ,  LIU, Feng, Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  WANG, Yan ,  HU, Yongqi ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  TU, Wen-Chiang ,  HSU, Wei-Yung

Inventor： LIU, Feng, Q. ,  DU, Tianbao ,  DUBOUST, Alain ,  WANG, Yan ,  HU, Yongqi ,  TSAI, Stan, D. ,  CHEN, Liang-Yuh ,  TU, Wen-Chiang ,  HSU, Wei-Yung

IPC: B23H5/00

CPC classification number: B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/6875 ,  H01L21/7684

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.

Abstract translation: 提供抛光组合物和从基底表面除去导电材料的方法。 在一个方面中，提供了一种用于以比通过电化学机械抛光技术在布置在基板中形成的宽特征定义上的导电材料更高的移除速率处理基板以去除设置在基板中形成的窄特征定义上的导电材料的方法，以及 然后用至少一种化学机械抛光技术抛光基片。

公开(公告)号：WO2006121600A2

公开(公告)日：2006-11-16

申请号：PCT/US2006/015386

申请日：2006-04-25

Applicant: APPLIED MATERIALS, INC. ,  WANG, Zhihong ,  WANG, You ,  MAO, Daxin ,  JIA, Renhe ,  TSAI, Stan D. ,  HU, Yongqi ,  TIAN, Yuan A. ,  CHEN, Liang-Yuh

Inventor： WANG, Zhihong ,  WANG, You ,  MAO, Daxin ,  JIA, Renhe ,  TSAI, Stan D. ,  HU, Yongqi ,  TIAN, Yuan A. ,  CHEN, Liang-Yuh

IPC: C25F3/02

CPC classification number: C25F3/02 ,  B23H5/08 ,  C09G1/02 ,  H01L21/32125 ,  H01L21/7684

Abstract: Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

Abstract translation: 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，并移除 导电材料层。