公开(公告)号：WO2021189000A1

公开(公告)日：2021-09-23

申请号：PCT/US2021/023327

申请日：2021-03-19

Applicant: APPLIED MATERIALS, INC.

Inventor： BERGER, Alex ,  HUDGENS, Jeffrey ,  ENGLHARDT, Eric

IPC: H01L21/67 ,  H01L21/677 ,  B25J11/00

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

公开(公告)号：WO2020072507A1

公开(公告)日：2020-04-09

申请号：PCT/US2019/054089

申请日：2019-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： NEWMAN, Jacob ,  OLDENDORF, Ulrich ,  AENIS, Martin ,  CONSTANT, Andrew J. ,  ASSAF, Shay ,  HUDGENS, Jeffrey C. ,  BERGER, Alex ,  WEAVER, William T.

IPC: H01L21/677 ,  H01L21/67

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.