公开(公告)号：WO2021055991A1

公开(公告)日：2021-03-25

申请号：PCT/US2020/051969

申请日：2020-09-22

Applicant: APPLIED MATERIALS, INC.

Inventor： WEAVER, William T. ,  CONSTANT, Andrew J. ,  ASSAF, Shay ,  NEWMAN, Jacob

IPC: H01L21/67 ,  H01L21/677

Abstract: Embodiments of the disclosure are directed to load lock chambers and methods of using load lock chambers. The load lock chambers include a middle section, an upper section connected to the middle section and a lower section connected to the middle section. A slit valve in a facet on the outside of the middle section provides an opening to access the middle volume from outside the load lock.

公开(公告)号：WO2022051373A1

公开(公告)日：2022-03-10

申请号：PCT/US2021/048681

申请日：2021-09-01

Applicant: APPLIED MATERIALS, INC.

Inventor： NEWMAN, Jacob ,  CONSTANT, Andrew J. ,  RICE, Michael R. ,  REUTER, Paul B. ,  ASSAF, Shay ,  KOSHTI, Sushant S.

IPC: B25J11/00 ,  B25J9/16 ,  B25J15/00 ,  H01L21/677

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

公开(公告)号：WO2020251696A1

公开(公告)日：2020-12-17

申请号：PCT/US2020/030744

申请日：2020-04-30

Applicant: APPLIED MATERIALS, INC.

Inventor： LERNER, Alexander N. ,  SHAVIV, Roey ,  KARAZIM, Michael P. ,  MORAES, Kevin Vincent ,  SANSONI, Steven V. ,  CONSTANT, Andrew J. ,  BRODINE, Jeffrey Allen ,  VELLORE, Kim Ramkumar ,  SADE, Amikam ,  KUMAR, Niranjan

IPC: C23C16/54 ,  C23C16/02 ,  C23C16/04 ,  C23C16/40 ,  C23C14/56 ,  C23C14/12 ,  C23C28/00 ,  H01L21/67 ,  H01L31/0256

Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.

公开(公告)号：WO2023064301A1

公开(公告)日：2023-04-20

申请号：PCT/US2022/046317

申请日：2022-10-11

Applicant: APPLIED MATERIALS, INC.

Inventor： KOSHTI, Sushant S. ,  REUTER, Paul B. ,  PHILLIPS, David ,  NEWMAN, Jacob ,  CONSTANT, Andrew J. ,  RICE, Michael R. ,  ASSAF, Shay ,  GOPALAKRISHNA, Srinivas Poshatrahalli ,  HOLEYANNAVAR, Devendra Channappa ,  BAUMGARTEN, Douglas B. ,  RAMACHANDRAIAH, Arunkumar ,  RAMACHANDRAN, Narayanan

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  B25J11/00 ,  B25J9/04 ,  B25J9/00 ,  B25J15/00

Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

公开(公告)号：WO2020242610A1

公开(公告)日：2020-12-03

申请号：PCT/US2020/028042

申请日：2020-04-14

Applicant: APPLIED MATERIALS, INC.

Inventor： LERNER, Alexander N. ,  KARAZIM, Michael P. ,  CONSTANT, Andrew J. ,  BRODINE, Jeffrey A. ,  VELLORE, Kim Ramkumar ,  MORAES, Kevin ,  SHAVIV, Roey

IPC: H01L21/68 ,  H01L21/673 ,  H01L21/67 ,  H01L21/677 ,  C23C16/04

Abstract: An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.

公开(公告)号：WO2020072507A1

公开(公告)日：2020-04-09

申请号：PCT/US2019/054089

申请日：2019-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： NEWMAN, Jacob ,  OLDENDORF, Ulrich ,  AENIS, Martin ,  CONSTANT, Andrew J. ,  ASSAF, Shay ,  HUDGENS, Jeffrey C. ,  BERGER, Alex ,  WEAVER, William T.

IPC: H01L21/677 ,  H01L21/67

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

公开(公告)号：WO2020242611A1

公开(公告)日：2020-12-03

申请号：PCT/US2020/028046

申请日：2020-04-14

Applicant: APPLIED MATERIALS, INC.

Inventor： LERNER, Alexander N. ,  KARAZIM, Michael P. ,  CONSTANT, Andrew J. ,  BRODINE, Jeffrey A. ,  VELLORE, Kim Ramkumar ,  MORAES, Kevin ,  SHAVIV, Roey

IPC: H01L21/68 ,  H01L21/673 ,  H01L21/677 ,  H01L21/67 ,  C23C16/04

Abstract: An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

公开(公告)号：WO2020180412A1

公开(公告)日：2020-09-10

申请号：PCT/US2020/015085

申请日：2020-01-24

Applicant: APPLIED MATERIALS, INC.

Inventor： SHANTHAVEERASWAMY, Shreyas Patil ,  GAUTAM, Ribhu ,  NAGARAJAN, Kumaresan ,  SINGH, Vijay ,  CONSTANT, Andrew J. ,  KARAZIM, Michael P. ,  VELLORE, Kim Ramkumar

IPC: H01L21/677 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.

公开(公告)号：WO2014143662A1

公开(公告)日：2014-09-18

申请号：PCT/US2014/027567

申请日：2014-03-14

Applicant: APPLIED MATERIALS, INC

Inventor： WEAVER, William T. ,  DANIEL, JR., Malcolm N. ,  VOPAT, Robert B. ,  SCHALLER, Jason M. ,  NEWMAN, Jacob ,  KANAWADE, Dinesh ,  CONSTANT, Andrew J. ,  HICKERSON, Stephen C. ,  HUDGENS, Jeffrey C. ,  FREEMAN, Marvin L.

IPC: H01L21/677 ,  B65G49/07 ,  B25J9/04 ,  H01L21/205

CPC classification number: B25J9/1682 ,  B25J9/043 ,  B25J11/0095 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  Y10S901/29 ,  Y10T74/20305

Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.

Abstract translation: 描述电子设备处理系统。 该系统包括主体壳体，其具有传送室，第一小面，与第一小面相对的第二小面，第三小面和与第三小面相对的第四小面，耦合到第一小面的第一旋转木马组件，第二转盘组件 耦合到第三小面，耦合到第二小面的第一负载锁定，耦合到第四小面的第二负载锁和适于在传送室中操作以从第一和第二转盘交换衬底的机器人。 还有许多其他方面描述了用于传输基底的方法和多轴机器人。