公开(公告)号：WO2021263202A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/039244

申请日：2021-06-25

Applicant: APPLIED MATERIALS, INC.

Inventor： GADGIL, Shantanu Rajiv ,  PATANKAR, Sumit Subhash ,  DAVIS, Nathan Arron ,  COUGHLIN, Michael J. ,  D'AMBRA, Allen L.

IPC: B24B53/017 ,  B24B53/00 ,  B24B37/30 ,  H01L21/67

Abstract: A pad conditioner head cleaning tool has a first clamp configured to removably engage a first portion of a sponge against an outer surface of a disk-shaped pad conditioner head at a first location, a second clamp configured to removable engage a second portion of the sponge against the outer surface of the disk-shaped pad conditioner head at a second location, and an arm coupling the first clamp to the second clamp. The arm is sufficiently flexible to permit the first clamp and the second clamp to be separated to fit around the disk-shaped pad conditioner head and sufficiently tensile to bias the first clamp and the second clamp inwardly to press the sponge against an outer surface of a pad conditioner head.

公开(公告)号：WO2021262612A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/038296

申请日：2021-06-21

Applicant: APPLIED MATERIALS, INC.

Inventor： GADGIL, Shantanu Rajiv ,  PATANKAR, Sumit Subhash ,  DAVIS, Nathan Arron ,  D'AMBRA, Allen L.

IPC: B24B37/34 ,  B24B37/20 ,  B24B41/047 ,  H01L21/67 ,  B08B1/008 ,  B08B1/04 ,  B41J11/36 ,  B41J29/17

Abstract: In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.

公开(公告)号：WO2021263043A1

公开(公告)日：2021-12-30

申请号：PCT/US2021/038981

申请日：2021-06-24

Applicant: APPLIED MATERIALS, INC.

Inventor： NANGOY, Roy C. ,  GADGIL, Shantanu Rajiv ,  DAVIS, Nathan Arron ,  D'AMBRA, Allen L. ,  COUGHLIN, Michael J. ,  PATANKAR, Sumit Subhash

IPC: B24B53/017 ,  B24B37/32 ,  H01L21/67 ,  B24B37/34 ,  B24B57/02

Abstract: A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly through an interior space of the enclosure onto the polishing pad, and a delivery arm cleaning tool removably attached to the polishing liquid delivery arm, the cleaning tool extending below the delivery arm and having a delivery arm-facing surface shaped such that the cleaning tool directs the cleaning fluid from the polishing liquid delivery arm on to a surface of the enclosure of the polishing liquid delivery arm.

公开(公告)号：WO2021183252A1

公开(公告)日：2021-09-16

申请号：PCT/US2021/017354

申请日：2021-02-10

Applicant: APPLIED MATERIALS, INC.

Inventor： GADGIL, Shantanu Rajiv ,  PATANKAR, Sumit Subhash ,  DAVIS, Nathan Arron ,  COUGHLIN, Michael J. ,  D'AMBRA, Allen L.

IPC: B24B53/017 ,  B24B37/04 ,  B24B37/30 ,  H01L21/304

Abstract: Embodiments herein relate to chemically impregnated applicators, which may be used to provide hydrophobic surfaces on CMP system components and related application methods. In one embodiment, a method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.