公开(公告)号：WO2022047297A1

公开(公告)日：2022-03-03

申请号：PCT/US2021/048216

申请日：2021-08-30

Applicant: APPLIED MATERIALS, INC.

Inventor： GUNAJI, Akshay ,  ULAVI, Tejas ,  BALUJA, Sanjeev

IPC: C23C16/458 ,  C23C16/46 ,  C23C16/455 ,  H01L21/67 ,  H01L21/683

Abstract: A heater assembly having a top seal and a second seal configured to account for deviation in processing heights and motor runoff of a heater standoff. The top seal is positioned between a shield plate and a top plate and the bottom seal is positioned between a heater mounting base and the heater standoff.

公开(公告)号：WO2021257318A1

公开(公告)日：2021-12-23

申请号：PCT/US2021/036286

申请日：2021-06-08

Applicant: APPLIED MATERIALS, INC.

Inventor： GUNAJI, Akshay ,  KULKARNI, Mayur Govind

IPC: C23C16/44 ,  C23C16/505 ,  C23C16/26 ,  H01L21/02 ,  C23C16/4412 ,  C23C16/458 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J37/32834 ,  H01J37/32899 ,  H01L21/02115 ,  H01L21/02274 ,  H01L21/0332 ,  H01L21/67017 ,  H01L21/6719

Abstract: Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The chambers may include a foreline conduit offset from a center of the base for exhausting a gas from the chamber body, and an exhaust volume coupled to the foreline conduit. The chambers may include a pumping plate comprising a central aperture through which the shaft extends, and further comprising exit apertures for directing at least a portion of the gas from the chamber body to the exhaust volume. The exit apertures may be disposed at locations opposite the foreline conduit so as to reduce nonuniformity in gas flow.

公开(公告)号：WO2022087573A1

公开(公告)日：2022-04-28

申请号：PCT/US2021/071911

申请日：2021-10-16

Applicant: APPLIED MATERIALS, INC.

Inventor： LI, Jian ,  DZILNO, Dmitry A. ,  ROCHA-ALVAREZ, Juan Carlos ,  BRILLHART, Paul L. ,  GUNAJI, Akshay ,  KULKARNI, Mayur Govind ,  BINDGI, Sandeep ,  KAMATH, Sanjay ,  LEE, Kwangduk Douglas ,  WANG, Zongbin ,  ZHANG, Yubin ,  LIM, Yong Xiang

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  C23C16/458 ,  H01J37/32

Abstract: Exemplary semiconductor processing systems include a processing chamber, a power supply, and a chuck disposed at least partially within the processing chamber. The chuck includes a chuck body defining a vacuum port. The chuck also includes first and second coplanar electrodes embedded in the chuck body and connected to the power supply. In some examples, coplanar electrodes include concentric electrodes defining a concentric gap in between. Exemplary semiconductor processing methods may include activating the power supply for the electrostatic chuck to secure a semiconductor substrate on the body of the chuck and/or activating the vacuum port defined by the body of the electrostatic chuck. Some processing can be carried out at increased pressure, while other processing can be carried out at reduced pressure with increased cucking voltage.

公开(公告)号：WO2022051377A1

公开(公告)日：2022-03-10

申请号：PCT/US2021/048685

申请日：2021-09-01

Applicant: APPLIED MATERIALS, INC.

Inventor： GUNAJI, Akshay ,  PAI, Uday ,  ROGGENBUCK, Timothy J. ,  BALUJA, Sanjeev ,  KARADI, Kalesh Panchaxari ,  ULAVI, Tejas

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

Abstract: Process assemblies and cable management assemblies for managing cables in tight envelopes. A processing assembly includes a top chamber having at least one substrate support, a support shaft, a robot spindle assembly, a stator and a a cable management system. The cable management system includes an inner trough assembly and an outer trough assembly configured to move relative to one another, and a plurality of chain links configured to house at least one cable for delivering power to the process assembly.