公开(公告)号：WO2014025508A1

公开(公告)日：2014-02-13

申请号：PCT/US2013/051017

申请日：2013-07-18

Applicant: APPLIED MATERIALS, INC.

Inventor： LAM, Winsor ,  MILLER, Keith A. ,  JOHNSON, Carl ,  RIKER, Martin Lee ,  XU, Ye

IPC: H01L21/203

CPC classification number: C23C14/046 ,  C23C14/54 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76865 ,  H01L21/76873 ,  H01L21/76879

Abstract: Methods and apparatus for processing a substrate in a process chamber, include receiving process control parameters for one or more devices from a process controller to perform a first chamber process, determining a time to send each of the process control parameters to the one or more devices, for each of the one or more devices, adjusting the determined time to send each of the process control parameters using specific signal process delays associated with each of the one or more devices, and sending the process control parameters to each of the one or more devices at the adjusted times to perform the first chamber process, wherein the synchronization controller includes one or more output channels, each channel directly coupled to one of the one or more devices.

Abstract translation: 用于在处理室中处理衬底的方法和装置包括从过程控制器接收用于一个或多个设备的过程控制参数，以执行第一室过程，确定将每个过程控制参数发送到一个或多个设备的时间 对于所述一个或多个设备中的每一个，使用与所述一个或多个设备中的每个设备相关联的特定信号处理延迟来调整所确定的时间以发送每个所述过程控制参数，以及将所述过程控制参数发送到所述一个或多个设备 在调整的时间进行第一室处理，其中所述同步控制器包括一个或多个输出通道，每个通道直接耦合到所述一个或多个设备之一。