公开(公告)号：WO2022187343A1

公开(公告)日：2022-09-09

申请号：PCT/US2022/018493

申请日：2022-03-02

申请人： APPLIED MATERIALS, INC.

发明人： FREITAS, Marcus Blake ,  ISHIKAWA, David Masayuki ,  PARKHE, Vijay D. ,  SIVARAMAKRISHNAN, Visweswaren

IPC分类号： H01L21/687 ,  H01L21/67 ,  G01K11/32

摘要： Apparatus and systems for temperature probe integration on pedestal heaters of a processing chamber including a cooling assembly for cooling temperature probes disposed within. Cooling assemblies can be actively water-cooled, passively cooled by fin stacks. Further cooling assemblies include a mechanical arm assembly for lowering or raising the temperature probes.

公开(公告)号：WO2021221728A1

公开(公告)日：2021-11-04

申请号：PCT/US2020/065708

申请日：2020-12-17

申请人： APPLIED MATERIALS, INC.

发明人： PARKHE, Vijay D. ,  SCHMID, Andreas ,  NOUJAIM, Andrew Antoine ,  PROUTY, Stephen Donald ,  GARCIA DE GORORDO, Alvaro ,  PEREZ-GUZMAN, Martin

IPC分类号： H01L21/683 ,  H01L21/67 ,  H02N13/00 ,  H01L21/687 ,  H01J37/32

摘要： A substrate support assembly is described herein that includes a facility plate, a ground plate coupled to the facility plate, a fluid conduit disposed within the substrate support assembly disposed through the facility plate and the ground plate, and a connector coupled to the ground plate that houses a portion of the fluid conduit. The connector includes a biasing assembly and a fastener disposed in a pocket formed in the ground plate.

公开(公告)号：WO2019231609A1

公开(公告)日：2019-12-05

申请号：PCT/US2019/030477

申请日：2019-05-02

申请人： APPLIED MATERIALS, INC.

发明人： HUANG, Tuochuan ,  PENG, Gang ,  GROECHEL, David W. ,  PARKHE, Vijay D. ,  KAWAGUCHI, Shinnosuke ,  BENJAMINSON, David

IPC分类号： H01L21/67 ,  H01L21/683 ,  H02N13/00 ,  B23Q3/15

摘要： Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.

公开(公告)号：WO2016014138A1

公开(公告)日：2016-01-28

申请号：PCT/US2015/029725

申请日：2015-05-07

申请人： APPLIED MATERIALS, INC.

发明人： PARKHE, Vijay D. ,  BABAYAN, Steven E. ,  MAKHRATCHEV, Konstantin ,  GUO, Zhiqiang ,  SOMMER, Phillip R. ,  MAROHL, Dan A.

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

摘要： Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

摘要翻译： 本文所述的实施方案提供了一种基板支撑组件，其能够对静电卡盘和加热组件之间的热传递进行横向和方位调节。 衬底支撑组件包括具有衬底支撑表面和下表面的主体，设置在主体中的一个或多个主电阻加热器，设置在主体中的多个可空间调节的加热器，以及耦合到多个 空间可调谐加热器，空间可调谐加热器控制器被配置为相对于多个空间可调谐加热器中的另一个来独立地控制多个空间可调加热器中的输出一个。

公开(公告)号：WO2022177632A1

公开(公告)日：2022-08-25

申请号：PCT/US2021/063908

申请日：2021-12-16

申请人： APPLIED MATERIALS, INC.

发明人： PARKHE, Vijay D.

IPC分类号： H01L21/683 ,  H01L21/67

摘要： Embodiments of the present disclosure generally relate to an electrostatic chuck assembly suitable for use in cryogenic applications, In one or more embodiments, an electrostatic chuck assembly is provided and includes an electrostatic chuck having a substrate supporting surface opposite a bottom surface, a cooling plate having a top surface, where the cooling plate contains an aluminum alloy having a CTE of less than 22 ppm, and a bonding layer securing the bottom surface of the electrostatic chuck and the top surface of the cooling plate, where the bonding layer contains a silicone material.

公开(公告)号：WO2019231614A1

公开(公告)日：2019-12-05

申请号：PCT/US2019/030741

申请日：2019-05-03

申请人： APPLIED MATERIALS, INC.

发明人： BENJAMINSON, David ,  PARKHE, Vijay D. ,  KORA SIDDARAMAIAH, Onkara Swamy ,  FLOYD, Kirby H. ,  WANG, Justin ,  SAMIR, Mehmet Tugrul ,  LUBOMIRSKY, Dmitry

IPC分类号： H01L21/683 ,  H01L21/67

摘要： Implementations described herein provide a substrate support assembly which enables temperature uniformity across a workpiece surface. In one embodiment, a substrate support assembly is provided that includes a body. The body made from ceramic. The body having a workpiece support surface and a mounting surface. The workpiece support surface and the bonding chuck body surface having a flatness of less than 10 microns. A first heater is disposed on the bottom surface outside the body. A bonding layer is disposed over the first heater, wherein the bonding layer is electrically insulating and a cooling base having a body made from a metal. The cooling body having an upper cooling body surface and a lower cooling body surface wherein the upper cooling body surface is less than about 10 microns flat.

公开(公告)号：WO2017213715A1

公开(公告)日：2017-12-14

申请号：PCT/US2017/015183

申请日：2017-01-26

申请人： APPLIED MATERIALS, INC.

发明人： CHO, Jaeyong ,  PARKHE, Vijay D. ,  WANG, Haitao ,  RAMASWAMY, Kartik ,  ZHANG, Chunlei

IPC分类号： H01L21/683 ,  H01L21/02

摘要： An electrostatic chuck is described that has radio frequency coupling suitable for use in high power plasma environments. In some examples, the chuck includes a base plate, a top plate, a first electrode in the top plate proximate the top surface of the top plate to electrostatically grip a workpiece, and a second electrode in the top plate spaced apart from the first electrode, the first and second electrodes being coupled to a power supply to electrostatically charge the first electrode.

摘要翻译： 描述了一种静电吸盘，其具有适用于高功率等离子体环境的射频耦合。 在一些示例中，卡盘包括底板，顶板，靠近顶板的顶表面的顶板中的第一电极以静电地夹持工件，并且顶板中的第二电极与第一电极间隔开 ，第一和第二电极连接到电源上以对第一电极进行静电充电。

公开(公告)号：WO2017213714A1

公开(公告)日：2017-12-14

申请号：PCT/US2017/014779

申请日：2017-01-24

申请人： APPLIED MATERIALS, INC.

发明人： CHO, Jaeyong ,  WANG, Haitao ,  PARKHE, Vijay D. ,  RAMASWAMY, Kartik ,  ZHANG, Chunlei

IPC分类号： H01L21/683 ,  H01L21/02 ,  H01L21/67

CPC分类号： H01J37/32724 ,  H01J37/32568 ,  H01J37/32706 ,  H01J37/32715 ,  H01L21/67109 ,  H01L21/6831

摘要： An electrostatic chuck is described to carry a workpiece for processing such as high power plasma processing. In embodiments, the chuck includes a top plate to carry the workpiece, the top plate having an electrode to grip the workpiece, a cooling plate under the top plate to cool the top plate, a gas hole through the cooling plate and the top plate to feed a gas to the workpiece through the top plate, and an aperture-reducing plug in the cooling plate gas hole to conduct gas flow through the hole.

摘要翻译： 描述了一种静电卡盘以承载用于诸如高功率等离子体处理之类的处理的工件。 在实施例中，卡盘包括用于承载工件的顶板，顶板具有夹住工件的电极，顶板下面的冷却板以冷却顶板，气孔穿过冷却板和顶板， 通过顶板向工件供给气体，并在冷却板气孔中形成减小孔径的塞子，以引导气体流过孔。

公开(公告)号：WO2017127611A1

公开(公告)日：2017-07-27

申请号：PCT/US2017/014233

申请日：2017-01-20

申请人： APPLIED MATERIALS, INC.

发明人： PARKHE, Vijay D.

IPC分类号： G01K7/16

CPC分类号： H05B1/0233 ,  G01K7/02 ,  G01K7/18 ,  H01L21/324 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831

摘要： A heater assembly for a substrate support assembly includes a body. The heater assembly further includes one or more main resistive heating elements disposed in the body and a plurality of additional resistive heating elements disposed in the body. The heater assembly further includes a plurality of temperature sensors disposed in the body, wherein one or more of the plurality of temperature sensors is disposed proximate to one of the plurality of additional resistive heating elements.

摘要翻译： 用于基板支撑组件的加热器组件包括主体。 加热器组件还包括设置在主体中的一个或多个主电阻加热元件和设置在主体中的多个附加电阻加热元件。 加热器组件还包括设置在主体中的多个温度传感器，其中多个温度传感器中的一个或多个设置在多个附加电阻加热元件中的一个附近。

公开(公告)号：WO2015103047A1

公开(公告)日：2015-07-09

申请号：PCT/US2014/072235

申请日：2014-12-23

申请人： APPLIED MATERIALS, INC.

发明人： PARKHE, Vijay D. ,  BUSCHE, Matthew J. ,  BOYD JR., Wendell ,  THACH, Senh ,  MAKHRATCHEV, Konstantin ,  ONO, Masanori

IPC分类号： H01L21/683 ,  H02N13/00 ,  B23Q3/15

CPC分类号： H01L21/6831 ,  H01L21/67109 ,  Y10T137/0318

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, an apparatus has a dielectric puck to electrostatically grip a silicon wafer. A cooling plate is fastened to and thermally coupled to the ceramic puck. A supply plenum receives coolant from an external source and a plurality of coolant chambers are thermally coupled to the cooling plate and receive coolant from the supply plenum. A return plenum is coupled to the cooling zones to exhaust coolant from the cooling zones. A plurality of adjustable orifices are positioned between the supply plenum and a respective one of the cooling zones to control the flow rate of coolant from the supply plenum to the cooling zones.

摘要翻译： 使用外部流量调节来描述静电卡盘，以改善温度分布。 在一个示例中，设备具有用于静电夹持硅晶片的电介质盘。 冷却板被紧固并热耦合到陶瓷盘。 供应气室从外部源接收冷却剂，并且多个冷却剂室热耦合到冷却板并从供应气室接收冷却剂。 回流室连接到冷却区以从冷却区排出冷却剂。 多个可调孔口位于供气室和相应的一个冷却区之间，以控制冷却剂从供气室到冷却区的流量。