公开(公告)号：WO2023003625A1

公开(公告)日：2023-01-26

申请号：PCT/US2022/030688

申请日：2022-05-24

Applicant: APPLIED MATERIALS, INC.

Inventor： TERRY, Thomas Lawrence ,  SIN, Garrett Ho Yee ,  KENGUNTI, Basavaraja Shankarappa

IPC: B24B37/32 ,  H01L21/67

Abstract: Embodiments of the disclosure generally relate to a retaining ring assembly having an annular lower portion, and an annular upper portion. The annular lower portion includes a step feature and an interlocking feature. In some configurations, adhesive is selective deposited on the step feature and the interlocking feature. The annular upper portion includes an opposing step recess, a first gap feature, an opposing interlocking recess and a second gap feature. When the upper portion and the lower portion are mated together, the interlocking recess is snapped into the upper portion tightly securing the lower portion to the upper portion.

公开(公告)号：WO2018039525A1

公开(公告)日：2018-03-01

申请号：PCT/US2017/048553

申请日：2017-08-25

Applicant: APPLIED MATERIALS, INC.

Inventor： HU, Yongqi ,  TERRY, Thomas Lawrence

IPC: H01L21/304 ,  H01L21/677 ,  H01L21/67

Abstract: A semiconductor fabrication system includes a chemical mechanical polishing system, a cassette holding area enclosed by a wall and having a door openable by an operator to place one or more cassettes into the cassette holding area, a robot configured to transfer substrates between a cassette in the cassette holding area to the chemical mechanical polishing system, a computer controller configured to cause the robot to move to a home position, a circuit breaker in a power supply line to the robot, a door sensor to detect whether the door is open, a robot presence sensor to detect whether the robot is in the home position, and control circuitry configured to receive signals from the door sensor and the robot presence sensor and cause the circuit breaker to cut power to the robot if the door is open and the robot is not in the home position.

Abstract translation: 半导体制造系统包括化学机械抛光系统，由壁包围并且具有可由操作者打开以将一个或多个盒子放入盒子保持区域的门的盒子保持区域，机器人被配置 以在盒子保持区域中的盒子与化学机械抛光系统之间传送基板，配置成使机器人移动到原始位置的计算机控制器，到机器人的电源线路中的断路器，用于检测 门是否打开;机器人存在传感器，检测机器人是否处于原始位置;以及控制电路，配置为接收来自门传感器和机器人存在传感器的信号，并且如果 门打开，机器人不在原位。

公开(公告)号：WO2017146735A1

公开(公告)日：2017-08-31

申请号：PCT/US2016/019916

申请日：2016-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： HU, Yongqi ,  NARENDRNATH, Kadthala Ramaya ,  TERRY, Thomas Lawrence

IPC: H01L21/304

CPC classification number: B24B37/00 ,  B24B37/205 ,  B24B37/22

Abstract: A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid- impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

Abstract translation: 抛光垫包括具有抛光表面，底表面和从抛光表面到底表面的孔的抛光层叠层。 抛光层叠层包括具有抛光表面的抛光层。 流体不可渗透的层跨越孔和抛光垫。 第一粘合剂材料的第一粘合剂层与抛光层的底表面接触并将其固定到流体不可渗透的层上。 第一粘合剂层跨越孔和抛光垫。 透光体位于孔中并具有与其接触的下表面，固定到第一粘合剂层，并且与孔的侧壁间隔开一间隙。 不同第二材料的粘合剂密封剂被布置并横向填充间隙。

公开(公告)号：WO2010062840A3

公开(公告)日：2010-06-03

申请号：PCT/US2009/065433

申请日：2009-11-23

Applicant: APPLIED MATERIALS, INC. ,  LISCHKA, David James ,  TERRY, Thomas Lawrence

Inventor： LISCHKA, David James ,  TERRY, Thomas Lawrence

IPC: H01L21/304 ,  H01L21/66

Abstract: Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer.