公开(公告)号：WO2020149898A1

公开(公告)日：2020-07-23

申请号：PCT/US2019/054124

申请日：2019-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： WU, Wen-Hao ,  CHEN, Jrjyan Jerry

IPC: H01L51/00 ,  H01L51/56

Abstract: Embodiments of the present disclosure generally relate to methods for forming an organic light emitting diode (OLED) device. Forming the OLED device comprises depositing a first barrier layer on a substrate having an OLED structure disposed thereon. A first sublayer of a buffer layer is then deposited on the first barrier layer. The first sublayer of the buffer layer is cured with a mixed gas plasma. Curing the first sublayer comprises generating water from the mixed gas plasma in a process chamber in which the curing occurs. The deposition of the first sublayer and the curing of the first sublayer is repeated one or more times to form a completed buffer layer. A second barrier layer is then deposited on the completed buffer layer.

公开(公告)号：WO2022245605A1

公开(公告)日：2022-11-24

申请号：PCT/US2022/028723

申请日：2022-05-11

Applicant: APPLIED MATERIALS, INC.

Inventor： SINGH, Vibhas ,  WU, Wen-Hao ,  CHEN, Jrjyan Jerry ,  CHOI, Soo Young

IPC: C23C16/30 ,  C23C16/36 ,  A61J1/14 ,  A61J1/06

Abstract: Packaging materials and methods of manufacture are disclosed. The packaging material comprises a substrate surface and film coating selected from the group consisting of an elastomer, a polymer, an inorganic material and combinations thereof. The film coating includes a first layer and a second layer, the first layer deposited on the second layer. The first layer has a formula of SiOxNyCz, where x is in a range from 1.9 to 2.15, y is in a range from 0.01 to 0.08, and z is in a range from 0.10 to 0.40.

公开(公告)号：WO2023014897A1

公开(公告)日：2023-02-09

申请号：PCT/US2022/039443

申请日：2022-08-04

Applicant: APPLIED MATERIALS, INC.

Inventor： CHEN, Chung-Chia ,  CHOUNG, Ji-young ,  HAAS, Dieter ,  LIN, Yu-Hsin ,  LEE, Jungmin ,  WU, Wen-Hao ,  KIM, Si Kyoung

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/50

Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub- pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

公开(公告)号：WO2021173309A1

公开(公告)日：2021-09-02

申请号：PCT/US2021/016243

申请日：2021-02-02

Applicant: APPLIED MATERIALS, INC.

Inventor： WU, Wen-Hao ,  CHEN, Jrjyan Jerry

IPC: H01L51/56 ,  H01L51/52

Abstract: A method and apparatus for forming an encapsulation layer on an organic light emitting diode (OLED) patterned substrate are described. A sidewall planarization layer fills voids in a scalloped sidewall of a wall feature on the OLED patterned substrate. The sidewall planarization layer is cured in the same chamber as the deposition of the sidewall planarization layer. A barrier layer is formed on the sidewall planarization layer. The sidewall planarization layer provides a planarized surface for good adhesion of the barrier layer over the sidewall planarization layer which minimizes the possibility of defects to the OLED patterned substrate from moisture of oxygen penetrating the OLED patterned substrate.