公开(公告)号：WO2019078829A1

公开(公告)日：2019-04-25

申请号：PCT/US2017/057028

申请日：2017-10-17

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  DIAZ, Jesus, Espinoza ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: G02B1/11 ,  G02B5/02 ,  G02F1/1335

Abstract: Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi -interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m 3 .

公开(公告)号：WO2019010001A1

公开(公告)日：2019-01-10

申请号：PCT/US2018/038349

申请日：2018-06-19

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: B29D11/00 ,  G02B11/04

Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness > H) that comparable glass hard materials offer.

公开(公告)号：WO2019013939A1

公开(公告)日：2019-01-17

申请号：PCT/US2018/038614

申请日：2018-06-20

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: H01L29/04

CPC classification number: H01L29/78636 ,  H01L29/04 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/7869

Abstract: Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.