公开(公告)号：WO2019078829A1

公开(公告)日：2019-04-25

申请号：PCT/US2017/057028

申请日：2017-10-17

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  DIAZ, Jesus, Espinoza ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: G02B1/11 ,  G02B5/02 ,  G02F1/1335

Abstract: Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi -interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m 3 .

公开(公告)号：WO2018194936A1

公开(公告)日：2018-10-25

申请号：PCT/US2018/027654

申请日：2018-04-13

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  ARREAGA-SALAS, David

IPC: C08K5/37 ,  H01L21/02 ,  H01L21/331

Abstract: Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.

公开(公告)号：WO2019010001A1

公开(公告)日：2019-01-10

申请号：PCT/US2018/038349

申请日：2018-06-19

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: B29D11/00 ,  G02B11/04

Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness > H) that comparable glass hard materials offer.

公开(公告)号：WO2018098430A1

公开(公告)日：2018-05-31

申请号：PCT/US2017/063274

申请日：2017-11-27

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  ARREAGA-SALAS, David

IPC: H01L23/24

Abstract: Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.

公开(公告)号：WO2018049431A1

公开(公告)日：2018-03-15

申请号：PCT/US2017/058586

申请日：2017-10-26

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  ARREAGA-SALAS, David

IPC: H01L21/02 ,  H05K1/02 ,  H05K1/14

Abstract: A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

Abstract translation:

用于可拉伸电子元件的大块基板。 大块衬底是用形成大块衬底的软弹性区域的工艺制造的。 软弹性区域包括大于或等于25％的应变容量和低于大块衬底的最大局部模量的10％的第一杨氏模量。 该工艺还形成大块衬底的刚性弹性区域。 硬弹性区域包括小于或等于5％的应变容量和大于大块衬底的最大局部模量的10％的第二杨氏模量。

公开(公告)号：WO2018144280A1

公开(公告)日：2018-08-09

申请号：PCT/US2018/015026

申请日：2018-01-24

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  ARREAGA-SALAS, David

IPC: G02B5/20 ,  G02B5/22 ,  B05D1/06

Abstract: Provided are flexible color filters and methods of manufacturing flexible color filters. An example flexible color filter comprises a transparent flexible substrate comprising a thermoset thiol-click polymer. An example method of manufacturing a flexible color filter comprises dispensing a release layer on a stiff carrier substrate; dispensing a polymer resin on the release layer; curing the polymer resin into a transparent film; fabricating a flexible color filter on the transparent film; and removing the flexible color filter from the release layer and stiff carrier substrate.

公开(公告)号：WO2021118525A1

公开(公告)日：2021-06-17

申请号：PCT/US2019/065281

申请日：2019-12-09

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  YANG, Kejia

IPC: H01L27/12 ,  H01L27/02 ,  H01L27/32

Abstract: A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.

公开(公告)号：WO2019013939A1

公开(公告)日：2019-01-17

申请号：PCT/US2018/038614

申请日：2018-06-20

Applicant: ARES MATERIALS INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  VOUTSAS, Apostolos ,  ARREAGA-SALAS, David

IPC: H01L29/04

CPC classification number: H01L29/78636 ,  H01L29/04 ,  H01L29/66742 ,  H01L29/785 ,  H01L29/7869

Abstract: Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.

公开(公告)号：WO2017200705A1

公开(公告)日：2017-11-23

申请号：PCT/US2017/028879

申请日：2017-04-21

Applicant: ARES MATERIALS, INC.

Inventor： REIT, Radu ,  AVENDANO-BOLIVAR, Adrian ,  ARREAGA-SALAS, David

IPC: H01L21/02 ,  H01L21/331 ,  H01L27/01 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  C08K5/37

Abstract: Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt% to about 65 wt% of one or more thiol monomers and from about 25 wt% to about 65 wt% of one or more co-monomers.

Abstract translation: 提供灵活的电子组件和使用方法。 示例柔性电子叠层包括柔性聚合物基底膜和刚性无机电子部件。 柔性聚合物基材膜包括通过固化单体溶液制备的热固性聚合物; 其中所述单体溶液包含约25重量％至约65重量％的一种或多种硫醇单体和约25重量％至约65重量％的一种或多种共聚单体。