公开(公告)号：WO2023084063A1

公开(公告)日：2023-05-19

申请号：PCT/EP2022/081686

申请日：2022-11-12

Applicant: ASML NETHERLANDS B.V.

Inventor： REN, Jiaxing ,  FAN, Yongfa ,  CHEN, Yi-Yin ,  ZHANG, Chenji ,  ZHENG, Leiwu

IPC: G03F7/20

Abstract: Machine learning models can be trained to predict imaging characteristics with respect to variation in a pattern on a wafer resulting from a patterning process. However, due to low pattern coverage provided by limited wafer data used for training, machine learning models tend to overfit, and predictions from the machine learning models deviate from physical trends that characterize the pattern on the wafer and/or the patterning process with respect to the pattern variation. To enhance pattern coverage, training data is augmented with pattern data that conforms to a certain expected physical trend, and applies to new patterns not covered by previously measured wafer data.

公开(公告)号：WO2023088641A1

公开(公告)日：2023-05-25

申请号：PCT/EP2022/079676

申请日：2022-10-24

Applicant: ASML NETHERLANDS B.V.

Inventor： REN, Jiaxing ,  CHEN, Yi-Yin ,  FAN, Yongfa ,  LIANG, Jiao

IPC: G03F1/36 ,  G03F7/20 ,  G06T17/20

Abstract: A grid dependency check for a simulation model is described. According to embodiments of the present disclosure, a grid dependency check can be advantageously performed faster and more efficiently compared to prior grid dependency checks. Certain portions of a design layout are selected and cropped to the minimum size required by the model, and used to generate a second design layout. 5 The selected portions are rotated and/or shifted relative to the grid to form one or more moved portions. The second design layout includes the one or more selected portions and the one or more moved portions so that a modeling operation (e.g., model apply) needs to only run a single time instead of multiple times as in the prior grid dependency checks.