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公开(公告)号：WO2023016723A1
公开(公告)日：2023-02-16
申请号：PCT/EP2022/069169
申请日：2022-07-08
Applicant: ASML NETHERLANDS B.V.
Inventor： WANG, Fuming , WIELAND, Marco, Jan-Jaco , CAO, Yu , ZHANG, Guohong
Abstract: An improved methods and systems for detecting defect(s) on a mask are disclosed. An improved method comprises inspecting an exposed wafer after the wafer was exposed, by a lithography system using a mask, with a selected process condition that is determined based on a mask defect printability under the selected process condition; and identifying, based on the inspection, a wafer defect that is caused by a defect on the mask to enable identification of the defect on the mask.
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