公开(公告)号：WO2009076437A1

公开(公告)日：2009-06-18

申请号：PCT/US2008/086221

申请日：2008-12-10

Applicant: ATI TECHNOLOGIES ULC ,  HUNKINS, James, D. ,  KING, Lawrence, J. ,  KODURI, Raja

Inventor： HUNKINS, James, D. ,  KING, Lawrence, J. ,  KODURI, Raja

IPC: H01R12/22 ,  G06F13/40 ,  H05K7/20

CPC classification number: H01R12/7082 ,  H01R12/724 ,  H01R2201/06

Abstract: In one example an electronic device includes a housing that includes an A/C input or DC input, and at least one circuit substrate that includes electronic circuitry, such as graphics processing circuitry that receives power based on the A/C input or DC input. The electronic device also includes a divided multi- connector element differential bus connector that is coupled to the electronic circuitry. The divided multi-connector element differential bus connector includes a single housing that connects with the circuit substrate and the connector housing includes therein a divided electronic contact configuration comprised of a first group of electrical contacts divided from an adjacent second group of mirrored electrical contacts wherein each group of electrical connects includes a row of at least lower and upper contacts. In one example, the electronic device housing includes air flow passages, such as grills, adapted to provide air flow through the housing. The electronic device housing further includes a passive or active cooling mechanism such as a fan positioned to cool the circuitry during normal operation. In one example, the electronic device does not include a host processor and instead a host processor is in a separate electronic device that communicates with the graphics processing circuitry through the divided multi connector element differential bus connector. In another example, a CPU (or one or more CPUs) is also co-located on the circuit substrate with the circuitry to provide a type of parallel host processing capability with an external device.

Abstract translation: 在一个示例中，电子设备包括包括A / C输入或DC输入的壳体，以及包括电子电路的至少一个电路基板，诸如基于A / C输入或DC输入接收功率的图形处理电路。 电子设备还包括耦合到电子电路的分开的多连接器元件差分总线连接器。 分离的多连接器元件差分总线连接器包括与电路基板连接的单个壳体，并且连接器壳体包括分开的电子接触配置，其包括由相邻的第二组镜像电触点分开的第一组电触点，其中每个 电连接组包括一排至少下部和上部触点。 在一个示例中，电子设备壳体包括适于提供空气流过壳体的空气流通道，例如格栅。 电子设备外壳还包括无源或主动冷却机构，例如风扇，其定位成在正常操作期间冷却电路。 在一个示例中，电子设备不包括主机处理器，而是主机处理器位于通过分开的多连接器元件差分总线连接器与图形处理电路通信的单独的电子设备中。 在另一示例中，CPU（或一个或多个CPU）也与电路共同位于电路基板上，以提供与外部设备的并行主机处理能力的类型。

公开(公告)号：WO2009076436A1

公开(公告)日：2009-06-18

申请号：PCT/US2008/086219

申请日：2008-12-10

Applicant: ATI TECHNOLOGIES ULC ,  HUNKINS, James, D. ,  KING, Lawrence, J. ,  HUSSAIN, Syed, A.

Inventor： HUNKINS, James, D. ,  KING, Lawrence, J. ,  HUSSAIN, Syed, A.

IPC: H01R13/514

CPC classification number: G09G5/363 ,  G06F3/14 ,  G09G5/39 ,  G09G2330/021 ,  G09G2360/06 ,  H01R12/716 ,  H01R12/724 ,  H01R24/60 ,  H01R2107/00

Abstract: A method includes reducing power of a first graphics processor by disabling or not using its rendering engine and leaving a display engine of the same first graphics processor capable of outputting display frames from a corresponding first frame buffer to a display. A display frame is rendered by a second graphics processor while the rendering engine of the first graphics processor is in a reduced power state, such as a non-rendering state. The rendered frame is stored in a corresponding second frame buffer of the second graphics processor, such as a local frame buffer and copied from the second frame buffer to the first frame buffer. The copied frame in the first frame buffer is then displayed on a display while the rendering engine of the first graphics processor is in the reduced power state. Accordingly thermal output and power output is reduced with respect to the first graphics processor since it does not do frame generation using its rendering engine, it only uses its display engine to display frames generated by the second graphics processor.

Abstract translation: 一种方法包括通过禁用或不使用其渲染引擎来减少第一图形处理器的功率，并且使能够将显示帧从相应的第一帧缓冲器输出到显示器的相同的第一图形处理器的显示引擎。 第二图形处理器呈现显示帧，而第一图形处理器的渲染引擎处于诸如非呈现状态的降低功率状态。 呈现的帧被存储在第二图形处理器的对应的第二帧缓冲器中，诸如本地帧缓冲器，并且从第二帧缓冲器复制到第一帧缓冲器。 第一帧缓冲器中的复制帧然后显示在第一图形处理器的渲染引擎处于降低功率状态的显示器上。 因此，相对于第一图形处理器，热输出和功率输出减少，因为它不使用其渲染引擎进行帧生成，它仅使用其显示引擎来显示由第二图形处理器生成的帧。

公开(公告)号：WO2009145806A1

公开(公告)日：2009-12-03

申请号：PCT/US2008/086216

申请日：2008-12-10

Applicant: ATI TECHNOLOGIES ULC ,  HUNKINS, James, D.

Inventor： HUNKINS, James, D.

IPC: H01R12/20 ,  G06F13/40

CPC classification number: H01R12/712

Abstract: An electrical connector, such as a circuit board connector, includes a housing having therein a divided multi-connector element. The electrical connector is adapted to electrically connect with a substrate, such as a circuit board. The divided multi-connector element includes a divided electrical contact configuration that includes a first group or subassembly of electrical contacts physically separate from an adjacent and second group or subassembly of contacts. The first group of electrical contacts and second group of electrical contacts each include a row of lower contacts and upper contacts. The second group of electrical contacts has an identical but mirrored configuration as the first group of electrical contacts.

Abstract translation: 诸如电路板连接器的电连接器包括其中具有分开的多连接器元件的壳体。 电连接器适于与诸如电路板的基板电连接。 分开的多连接器元件包括分开的电接触配置，其包括与接触件的相邻和第二组或组件物理分离的电触点的第一组或子组件。 第一组电触点和第二组电触头各自包括一排下触点和上触点。 第二组电触点具有与第一组电触点相同但是被镜像的配置。