中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.014 seconds)

    COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
    1.
    发明申请
    COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS 审中-公开
    铜和铜合金微蚀刻的组合物和方法

    公开(公告)号：WO2016096228A1

    公开(公告)日：2016-06-23

    申请号：PCT/EP2015/075310

    申请日：2015-10-30

    Applicant: ATOTECH DEUTSCHLAND GMBH

    Inventor： LAGER, Markku ,  CLICQUE, Arno ,  TEWS, Dirk

    IPC: C23F1/18 ,  H05K3/06 ,  H05K3/38

    CPC classification number: C23F1/18 ,  C23C28/321 ,  C23F1/46 ,  C23G1/103 ,  H05K3/062 ,  H05K3/064 ,  H05K3/383 ,  H05K2203/124

    Abstract: The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe 3+ ions, ii) at least a source of Br - ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula (I) wherein R1 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C 1 -C 5 -alkyl or C 1 -C 5 -alkoxy; R3, R4 are selected from the group consisting of hydrogen and C 1 -C 5 -alkyl; and X- is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

    Abstract translation: 本发明涉及一种用于铜或铜合金表面的微蚀刻的组合物，其中所述组合物包括：i）至少一种Fe 3+离子源，ii）至少一种Br离子源，iii）至少一种 无机酸，和iv）根据式（I）的至少一种蚀刻精炼剂，其中R 1选自氢，C 1 -C 5 - 烷基或取代的芳基或烷芳基; R 2选自氢，C 1 -C 5 - 烷基或C 1 -C 5 - 烷氧基; R 3，R 4选自氢和C 1 -C 5 - 烷基; 而X-是合适的阴离子。 此外，本发明涉及使用这种组合物对铜或铜合金表面进行微蚀刻的方法。

    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD
    2.
    发明申请
    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD 审中-公开
    制造印刷电路板的方法

    公开(公告)号：WO2018069421A1

    公开(公告)日：2018-04-19

    申请号：PCT/EP2017/076003

    申请日：2017-10-12

    Applicant: ATOTECH DEUTSCHLAND GMBH

    Inventor： CHO, Wonjin ,  LAGER, Markku ,  TEWS, Dirk ,  LIN, Cedric

    IPC: H05K3/28 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  H05K3/24

    Abstract: A method for manufacturing a printed circuit board, comprising in this order the steps (i) providing a non-conductive substrate having on at least one surface - a coper circuitry with a copper surface, wherein the copper surface is - chemically treated by (a) an oxidation and subsequent reduction reaction and/or (b) an organic compound attached to the copper surface, - a permanent, non-conductive, not fully polymerized cover layer covering at least partially said copper surface, (ii) thermally treating the substrate with the permanent, non-conductive, not fully polymerized cover layer at a temperature in the range from 40°C to 250°C in an atmosphere, which contains molecular oxygen in an amount of 100000 ppm or less, based on the total volume of the atmosphere, such that a substrate with a permanent, non-conductive cover layer is obtained, the cover layer being more polymerized compared to step (i), with the proviso: - that step (ii) is carried out after step (i) but before any metal or metal alloy is deposited onto the permanent, non-conductive, not fully polymerized cover layer, and - that in step (ii) the permanent, non-conductive, not fully polymerized cover layer is fully polymerized in solely one single thermal treating step, if the cover layer is a solder mask.

    Abstract translation: 一种用于制造印刷电路板的方法，该方法依次包括以下步骤：（i）提供在至少一个表面上具有铜表面的非导电衬底 - 具有铜表面的铜电路，其中所述铜 表面通过（a）氧化和随后的还原反应和/或（b）附着于铜表面的有机化合物进行化学处理， - 至少部分覆盖所述铜表面的永久的，非导电的，未完全聚合的覆盖层 ，（ii）在40℃至250℃的温度下，在含有100000ppm量的分子氧的气氛中，用永久的，非导电的，未完全聚合的覆盖层热处理基材或 基于大气的总体积，使得获得具有永久的非导电覆盖层的基材，与步骤（i）相比，覆盖层更多地聚合，附带条件是： - 步骤（ii） 在步骤（i）之后执行， 但在将任何金属或金属合金沉积到永久的，不导电的，未完全聚合的覆盖层上之前，以及 - 在步骤（ii）中，永久的，非导电的，未完全聚合的覆盖层仅在一个单一中完全聚合 热处理步骤，如果覆盖层是阻焊层。

Patent Agency Ranking