公开(公告)号：WO2022200548A1

公开(公告)日：2022-09-29

申请号：PCT/EP2022/057875

申请日：2022-03-25

Applicant: ATOTECH DEUTSCHLAND GMBH & CO. KG

Inventor： HAACK, Peter ,  PELDZINSKI-RANISCH, Vera ,  VAZHENIN, Grigory ,  SHIN, Hee-Bum ,  LEE, Jaewon ,  BERNHARD, Tobias

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/40 ,  C23F1/18 ,  C25D5/18 ,  C25D5/00 ,  C25D7/06 ,  H05K3/18 ,  C25D3/38 ,  H05K3/38

Abstract: A process for electrochemical deposition of copper, comprising - providing a rolled and annealed copper foil comprising a first surface and a second surface, - etching the first surface of the rolled and annealed copper foil, thereby creating a first etched surface, - depositing copper by electroless copper deposition on the first etched surface, thereby creating a first electroless copper layer on the first etched surface, - depositing further copper by electrochemical deposition on the first electroless copper layer, thereby creating a first electrochemical copper layer, wherein in the electrochemical deposition in a first period of time a first current density is applied and in a second period of time a second current density is applied, wherein the second current density is lower than the first current density, and a layered product obtainable by the process.