公开(公告)号：WO2005008170A3

公开(公告)日：2005-05-06

申请号：PCT/US2004022401

申请日：2004-07-14

Applicant: AUGUST TECHNOLOGY CORP

Inventor： WATKINS CORY ,  HARLESS MARK ,  ABRAHAM FRANCY ,  SIM HAK CHUAH

IPC: G01B20060101 ,  G06K9/00

CPC classification number: G01B1/00 ,  G06K9/00

Abstract: An edge inspection method (Figure 10) for detecting defects on a wafer surface (step 302 in Figure 10) includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands (step 306 in Figure 10). Adjacent edge clusters (step 314 in Figure 10) about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis (step 316 in Figure 10) to identify defects. The edge pixel bins are also analyzed via blob analysis (step 318 in Figure 10) to determine defects.

Abstract translation: 用于检测晶片表面上的缺陷的边缘检查方法（图10）（图10中的步骤302）包括获取捕获晶片周围的一组数字图像。 确定围绕圆周的晶片的边缘。 每个数字图像被分割成多个水平带（图10中的步骤306）。 围绕晶片圆周的相邻边缘簇（图10中的步骤314）被组合成边缘像素块。 通过边缘簇分析（图10中的步骤316）分析边缘像素箱，以识别缺陷。 还通过斑点分析（图10中的步骤318）分析边缘像素箱，以确定缺陷。