公开(公告)号：WO2015179089A1

公开(公告)日：2015-11-26

申请号：PCT/US2015/028237

申请日：2015-04-29

Applicant: COMMSCOPE TECHNOLOGIES LLC

Inventor： PATEL, Sammit, A. ,  XU, Yongjie ,  GU, Qiyun ,  BROWN, Richard, W.

IPC: H01L23/427 ,  H05K7/20

CPC classification number: H03F1/301 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/66 ,  H01L29/7816 ,  H01L2023/4031 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2223/6644 ,  H01L2924/0002 ,  H03F3/213 ,  H03F2200/411 ,  H03F2200/447 ,  H03F2200/451 ,  H05K1/0203 ,  H05K1/183 ,  H05K3/3421 ,  H05K3/3463 ,  H05K7/2029 ,  H05K7/20336 ,  H05K7/20936 ,  H05K2201/064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

Abstract translation: 在一个实施例中，电子系统包括印刷电路板，一个或多个封装的半导体器件，以及具有顶部和底部并且封闭部分地填充有冷却剂的密封腔的蒸气室。 蒸气室包括热导和导电材料。 蒸汽室的顶部具有形成在其中的一个或多个凹陷，每个凹陷接收并热导通地连接到相应的封装半导体器件的底部的至少部分，其通过PCB中的相应孔安装。 散热器可以热传导地连接到蒸气室的底部。