APPARATUS AND METHODS FOR ASSEMBLING A DISPLAY AREA

    公开(公告)号:WO2019094344A1

    公开(公告)日:2019-05-16

    申请号:PCT/US2018/059300

    申请日:2018-11-06

    IPC分类号: H01L25/075 H01L33/48

    摘要: A method of assembling a display area includes selecting a first tile from a plurality of tiles, each tile of the plurality of tiles includes a predetermined parameter and a plurality of microLEDs defining a plurality of pixels. The selecting the first tile based on a value of the predetermined parameter of the first tile. The method includes selecting a second tile from the plurality of tiles based on a value of the predetermined parameter of the second tile. The method further includes positioning the first tile and the second tile into an array defining at least a portion of the display area. A first edge of the first tile facing a second edge of the second tile. A display device including the display area assembled by the method is also provided.

    SYSTEMS AND METHODS FOR BULK PROCESSING SUBSTRATE WEBS
    3.
    发明申请
    SYSTEMS AND METHODS FOR BULK PROCESSING SUBSTRATE WEBS 审中-公开
    用于大量加工衬底织物的系统和方法

    公开(公告)号:WO2017034960A1

    公开(公告)日:2017-03-02

    申请号:PCT/US2016/047733

    申请日:2016-08-19

    IPC分类号: C03C15/00 C03C17/32 C03C21/00

    摘要: Systems and methods for batch processing glass substrate webs are disclosed. In one embodiment, a method of processing a glass substrate web includes applying a spacer layer to at least one of a first surface or a second surface of the glass substrate web, and rolling the spacer layer and the glass substrate web to form a spool. The spacer layer is configured such that a gap exists between the first surface and the second surface of the glass substrate web within the spool. The method further includes applying a fluid to the spool such that the fluid surrounds the spool and is disposed within the gap between the first surface and the second surface within the spool.

    摘要翻译: 公开了用于批处理玻璃基板网的系统和方法。 在一个实施例中,处理玻璃衬底腹板的方法包括将间隔层施加到玻璃衬底腹板的第一表面或第二表面中的至少一个,以及滚动间隔层和玻璃基底腹板以形成线轴。 间隔层被构造成使得在线轴内的玻璃基底腹板的第一表面和第二表面之间存在间隙。 该方法还包括将流体施加到阀芯,使得流体围绕阀芯并且设置在阀芯内的第一表面和第二表面之间的间隙内。

    PACKAGES AND METHODS OF PACKAGING GLASS SHEETS
    6.
    发明申请
    PACKAGES AND METHODS OF PACKAGING GLASS SHEETS 审中-公开
    包装玻璃纸的包装和方法

    公开(公告)号:WO2012075089A1

    公开(公告)日:2012-06-07

    申请号:PCT/US2011/062552

    申请日:2011-11-30

    IPC分类号: B65D57/00 B65D85/48

    摘要: Packages and methods of packaging a plurality of glass sheets provide a stack of glass sheets with an interleaf protective sheet positioned between each adjacent pair of glass sheets. An outer portion of each interleaf protective sheet is bent over a portion of the peripheral edge of one of a corresponding adjacent pair of glass sheets to discourage relative shifting of the glass sheets with respect to one another. The stack of glass sheets are sandwiched between pressure members of an outer housing such that the pressure members each apply a support pressure that is distributed over an outer surface of a corresponding one of the pair of outermost glass sheets of the stack of glass sheets.

    摘要翻译: 包装多个玻璃板的包装和方法提供了一叠玻璃板,其中夹层保护片定位在每对相邻的玻璃板之间。 每个夹层保护片的外部部分在对应的相邻玻璃板之一的周缘的一部分上弯曲,以阻止玻璃板相对于彼此的相对移动。 玻璃板堆叠在外壳的压力构件之间,使得压力构件分别施加支撑压力,该支撑压力分布在玻璃板堆叠的一对最外层玻璃板中的对应的一个的外表面上。

    METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS

    公开(公告)号:WO2023091328A1

    公开(公告)日:2023-05-25

    申请号:PCT/US2022/049195

    申请日:2022-11-08

    IPC分类号: H05K3/34 H05K3/10

    摘要: Methods of manufacturing an electronic apparatus include patterning an edge surface of a substrate to form a first recess, a second recess, and an extension portion. A first electrode is positioned on a first major surface of the substrate and extends to the first recess. A second electrode is positioned on the first major surface and extends to the second recess. Methods include applying an electrically-conductive material covering the first recess, the second recess, and the extension portion. Methods include removing a portion of the electrically-conductive material and a portion of the extension portion to isolate a first electrically-conductive line of the electrically-conductive material within the first recess from a second electrically-conductive line of the electrically-conductive material within the second recess. The first electrically-conductive line is electrically connected to the first electrode and the second electrically-conductive line is electrically connected to the second electrode. An electronic apparatus is provided.

    ELECTRONIC APPARATUS
    8.
    发明申请

    公开(公告)号:WO2021188271A1

    公开(公告)日:2021-09-23

    申请号:PCT/US2021/019551

    申请日:2021-02-25

    IPC分类号: H05K1/02 H01L23/498 H01L23/15

    摘要: An electronic apparatus includes a substrate including a first major surface, a second major surface, and an edge surface. The edge surface includes a radius of curvature extending between the first major surface and the second major surface. The electronic apparatus includes an opto-electronic device positioned on the first major surface. The electronic apparatus includes an electrical component positioned on the second major surface. The electronic apparatus includes a first electrically-conductive trace attached to the edge surface. The first electrically-conductive trace electrically connects a first portion of the opto-electronic device to the electrical component and defines a first current path. The electronic apparatus includes a second electrically-conductive trace extending through an opening in the substrate. The second electrically-conductive trace electrically connects a second portion of the opto-electronic device to the electrical component and defines a second current path different than the first current path.

    SYSTEMS AND METHODS FOR CREATING FLUIDIC ASSEMBLY STRUCTURES ON A SUBSTRATE
    10.
    发明申请
    SYSTEMS AND METHODS FOR CREATING FLUIDIC ASSEMBLY STRUCTURES ON A SUBSTRATE 审中-公开
    用于在衬底上创建流体组装结构的系统和方法

    公开(公告)号:WO2018085215A1

    公开(公告)日:2018-05-11

    申请号:PCT/US2017/059160

    申请日:2017-10-31

    IPC分类号: H01L27/15 H01L33/02

    摘要: Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structure on a substrate. The assembly panel comprises a substrate having a top surface; an electronics structure layer disposed over the top layer of the substrate; and a sol-gel based structural layer disposed over the top layer of the substrate and the electronics structure layer, wherein the sol-gel based structural layer includes openings exposing at least a part of the electronics structure layer.

    摘要翻译: 实施例涉及流体组装,并且更具体地涉及用于在衬底上形成物理结构的系统和方法。 组装面板包括具有顶面的基板; 设置在衬底的顶层上的电子结构层; 以及设置在所述衬底的顶层和所述电子结构层上的溶胶 - 凝胶基结构层,其中所述溶胶 - 凝胶基结构层包括暴露所述电子结构层的至少一部分的开口。