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1.发明申请
公开(公告)号：WO2019195375A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/025515
申请日：2019-04-03
Applicant: CORNING INCORPORATED
Abstract: Integrated circuit packages (100) having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a structured glass article (120) including a glass substrate (122), an optical channel (132), and redistribution layers. The integrated circuit package (100) further includes an integrated circuit chip (160) positioned on the glass substrate (122) and in optical communication with the optical channel (132) and in electrical continuity with the redistribution layers (136).
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公开(公告)号：WO2019191350A1
公开(公告)日：2019-10-03
申请号：PCT/US2019/024461
申请日：2019-03-28
Applicant: CORNING INCORPORATED
Inventor： BEALL, George Halsey , BOEK, Heather Debra , CAI, Ling , KIM, Jin Su , THELEN, Dean Michael , WELLER, Mark Owen
Abstract: A glass-ceramic that includes: S i O 2 from about 35 mol% to about 80 mol%; B 2 O 3 from about 10 mol% to about 50 mol%; P 2 O 5 from about 10 mol% to about 50 mol%; and an optional addition of one or more of CaO, MgO and Bi 2 O 3 from 0 mol% to about 5 mol%, wherein the glass-ceramic further comprises a boron-phosphate crystalline phase.
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公开(公告)号：WO2019161261A1
公开(公告)日：2019-08-22
申请号：PCT/US2019/018297
申请日：2019-02-15
Applicant: CORNING INCORPORATED
Inventor： BOEK, Heather Debra , DOHN, Paul Bennett , KIM, Jin Su , TIETZ MOORE, Lisa Anne
Abstract: Embodiments of a laminated glass article are provided. The article has a core layer, a first cladding layer, and a second cladding layer. The core layer has a core coefficient of thermal expansion (CTE). The core layer is disposed between the first cladding layer and the second cladding layer. Each of the first cladding layer and the second cladding layer are have a clad CTE. The clad CTE is less than the core CTE such that each of the first cladding layer and the second cladding layer is under a compressive stress and the core layer is under a tensile stress. The laminated glass article is substantially infrared transparent and substantially absorbs visible light. In embodiments, the laminated glass article is made via a fusion draw process and is usable as a LiDAR cover for a LiDAR sensor.
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4.发明申请
公开(公告)号：WO2021025981A1
公开(公告)日：2021-02-11
申请号：PCT/US2020/044436
申请日：2020-07-31
Applicant: CORNING INCORPORATED
Inventor： ALLAN, Douglas Clippinger , GOLYATIN, Vladislav Yuryevich , GORELCHENKO, Petr , HARRIS, Jason Thomas , KIM, Jin Su , LEZZI, Peter Joseph , ROUSSEV, Rostislav Vatchev , VENKATARAMAN, Natesan
Abstract: A laminated glass article comprises a core layer comprising a core glass composition, and a cladding layer directly adjacent to the core layer and comprising a clad glass composition. A stress of the cladding layer increases with increasing distance from an outer surface of the cladding layer from a compressive stress to a tensile stress, transitions to a compressive stress as a step-change at an interface region between the core layer and the cladding layer, and increases with increasing distance from the interface region to a center of the core layer from the compressive stress to a tensile stress.
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公开(公告)号：WO2020185392A1
公开(公告)日：2020-09-17
申请号：PCT/US2020/019642
申请日：2020-02-25
Applicant: CORNING INCORPORATED
Inventor： GORELCHENKO, Petr , KIM, Jin Su , ZHANG, Lu
Abstract: A glass substrate comprises a glass clad layer fused to a glass core layer. The glass core layer comprises a core glass composition having an average core coefficient of thermal expansion (CTE core ) and the glass clad layer comprises a clad glass composition having an average clad coefficient of thermal expansion (CTE clad ) that is less than the CTE c ore · A maximum tensile stress in the glass core layer is less than 15 MPa.
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Patent Agency Ranking
公开(公告)号：WO2021108079A1
公开(公告)日：2021-06-03
申请号：PCT/US2020/058459
申请日：2020-11-02
Applicant: CORNING INCORPORATED
Inventor： KIM, Jin Su , LEVESQUE JR., Daniel Wayne , LI, Aize , VANSELOUS, Heather Nicole
Abstract: Methods for fabricating laminate glass articles with blind vias in the form of through holes etched in one or more glass layers of the laminate glass articles. The methods may include forming a modified track or a pilot hole in a laminate glass. The laminate glass article includes a first glass layer formed of a first glass composition and a second glass layer and/or a third glass layer formed of a composition that is different from the first glass composition. After forming a modified track or pilot hole, the laminate glass may be exposed to etching conditions that etch a through hole in at least one of the second glass layer and / or third glass layer at the location of the modified track or pilot hole, but do not form an etched through hole in the first glass layer at the location of the modified track or pilot hole.
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公开(公告)号：WO2021096714A1
公开(公告)日：2021-05-20
申请号：PCT/US2020/058489
申请日：2020-11-02
Applicant: CORNING INCORPORATED
Inventor： KIM, Jin Su , XIAO, Yu , ZHANG, Liying
Abstract: A glass composition includes from about from about 50 mol. % to about 70 mol. % SiO2, from about 5 mol. % to about 10 mol. % Al2O3, from about 10 mol. % to about 20 mol. % Na2O, and from about 2 mol. % to about 6 mol. % K2O, wherein the glass composition has a Young's modulus of at least 65 GPa, and wherein the glass composition has a coefficient of thermal expansion between 10.0 and 13.0 ppm/°C. The glass compositions have high CTE, high Young's modulus and high UV transmission and can be used to form glass articles for use in making carrier substrates for semiconductor applications.
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8.发明申请
公开(公告)号：WO2019195378A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/025518
申请日：2019-04-03
Applicant: CORNING INCORPORATED
Inventor： KIM, Jin Su , POLLARD, Scott Christopher
Abstract: An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.
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公开(公告)号：WO2019195305A1
公开(公告)日：2019-10-10
申请号：PCT/US2019/025408
申请日：2019-04-02
Applicant: CORNING INCORPORATED
Inventor： KIM, Hoon , KIM, Jin Su
Abstract: A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.
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公开(公告)号：WO2016069822A1
公开(公告)日：2016-05-06
申请号：PCT/US2015/057924
申请日：2015-10-29
Applicant: CORNING INCORPORATED
Inventor： BOEK, Heather Debra , DABICH, Leonard Charles II , DENEKA, David Alan , KIM, Jin Su , KOVAL, Shari Elizabeth , LOGUNOV, Stephan Lvovich , QUESADA, Mark Alejandro , STRELTSOV, Alexander Mikhailovich
IPC: C03C3/14 , C03C3/247 , C03C17/02 , C03C17/06 , C03C17/23 , C03C23/00 , C03C27/04 , C03C27/06 , C03C27/10 , H01L51/52
CPC classification number: C03C23/0025 , C01G19/02 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C15/00 , C03C17/02 , C03C17/06 , C03C17/23 , C03C27/044 , C03C27/06 , C03C27/10 , H01L51/5246
Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ tensile stress location )/(σ interface laser weld )) interface laser weld > 10 MPa or > 1 MPa where σ tensile stress location is the stress present in the first substrate and σ interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.
Abstract translation: 一种形成密封装置的方法，包括提供具有第一表面的第一基底，提供与第一基底相邻的第二基底，以及在第一基底和相邻的第二基底的界面之间形成焊缝，其中焊缝的特征在于 （σtensilestress location）/（σinterfacelaser weld））<< 1或<1和σinterface激光焊接> 10 MPa或> 1 MPa其中σtensile应力位置是第一个衬底中存在的应力，而σinterface激光焊接是存在于 界面。 该方法可用于制造各种不同的密封包装。
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