公开(公告)号：WO2022150348A1

公开(公告)日：2022-07-14

申请号：PCT/US2022/011261

申请日：2022-01-05

Applicant: CREE, INC.

Inventor： OREJOLA, Erwin ,  CONDIE, Brian ,  ANDRE, Ulf

IPC: H01L23/49 ,  H01L23/66

Abstract: A packaged semiconductor device includes a first bond pad (225), a second bond pad (165, 165'), a first bond wire that includes a first end bonded to the first bond pad (225) and a second end bonded to the second bond pad (165, 165'), and a second bond wire that includes a first end that is electrically connected to the first bond pad (225) and a second end that is electrically connected to the second bond pad (165, 165'). The first end of the second bond wire is bonded to the first end of the first bond wire. A method of bonding a bond wire includes bonding a first end of a first bond wire to a contact surface of a first bond pad (225) and bonding a first end of a second bond wire to a surface of the first end of the first bond wire.