Abstract:
An RF module adapted for direct surface mounting to the front end of a picocell or microcell. The module includes a circuit board with a plurality of electrical components mounted thereon and defining respective RF signal transmit and receive sections. The signal transmit section is defined by at least a transmit bandpass filter, a power amplifier, an isolator, a coupler, and a duplexer. The signal receive section is defined by at least the duplexer, a receive low pass filter, a low-noise amplifier, and a receive bandpass filter. A lid covers selected ones of the electrical components except for at least the power amplifier. Through-holes in the circuit board below the power amplifier allow for the transfer of heat from the power amplifier.