公开(公告)号：WO2016130773A1

公开(公告)日：2016-08-18

申请号：PCT/US2016/017503

申请日：2016-02-11

Applicant: DEERE & COMPANY

Inventor： SINGH, Brij, N. ,  ROAN, Thomas ,  WIELAND, Andrew, D. ,  CLEMENTS, Neal, D.

IPC: H01L23/495

CPC classification number: H05K1/181 ,  H01L23/473 ,  H01L2023/4043 ,  H01L2023/4056 ,  H05K1/0203 ,  H05K1/0265 ,  H05K1/111 ,  H05K1/184 ,  H05K2201/0391

Abstract: An electronic assembly comprises a semiconductor device (48) that has conductive pads (66) on a semiconductor first side (72) and a metallic region (266) on a semiconductor second side (74) opposite the first side (72). A lead frame (16) provides respective separate terminals (54, 56) that are electrically and mechanically connected to corresponding conductive pads. A first heat sink (30) comprises a first component (37) having a mating side (62). A portion of the mating side (62) is directly bonded with the metallic region (266) of the semiconductor device (48). A circuit board has an opening for receiving the semiconductor device (48). The lead frame (16) extends outward toward the circuit board or a board first side of the circuit board.

Abstract translation: 一种电子组件包括半导体器件（48），该半导体器件在半导体第一侧（72）上具有导电垫（66），并且在半导体第二侧（74）上具有金属区（266） 第一侧（72）。 引线框架（16）提供相应的单独端子（54,56），其电连接和机械连接到对应的导电焊盘。 第一散热器（30）包括具有配合侧（62）的第一部件（37）。 配合侧（62）的一部分直接与半导体器件（48）的金属区域（266）结合。 电路板具有用于接收半导体器件（48）的开口。 引线框架（16）向外朝着电路板或电路板的电路板第一侧延伸。

公开(公告)号：WO2014137433A1

公开(公告)日：2014-09-12

申请号：PCT/US2013/074275

申请日：2013-12-11

Applicant: DEERE & COMPANY

Inventor： SINGH, Brij, N. ,  FISK, Aron ,  CLEMENTS, Neal, D. ,  WIELAND, Andrew, D.

IPC: G01R33/00 ,  G01R15/00

CPC classification number: G01R15/20 ,  G01R15/181 ,  G01R19/0007 ,  G01R31/42

Abstract: A sensor comprises primary ferrite members (362) spaced apart from the magnetic field sensor (20) on opposite sides of the magnetic field sensor to concentrate or steer an orientation of a magnetic field of the observed signal toward a target area (409) of the magnetic field sensor (20). A magnetic field sensor (20) senses a direct current signal component or lower frequency component of the observed signal. A first filtering circuit has a high-pass filter response. The first filtering circuit is coupled to the inductor to provide a filtered alternating current signal component. A second filtering circuit has a low-pass filter response. The second filtering circuit coupled to the magnetic field sensor to provide a filtered direct current signal component. A sensor fusion circuit determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract translation: 传感器包括在磁场传感器的相对侧上与磁场传感器（20）间隔开的主要铁氧体构件（362），以将观察信号的磁场的取向集中或转向朝向所述磁场传感器的目标区域（409） 磁场传感器（20）。 磁场传感器（20）感测观测信号的直流信号分量或较低频率分量。 第一滤波电路具有高通滤波器响应。 第一滤波电路耦合到电感器以提供滤波的交流信号分量。 第二滤波电路具有低通滤波器响应。 第二滤波电路耦合到磁场传感器以提供滤波的直流信号分量。 传感器融合电路基于经过滤波的交流信号分量和经滤波的直流信号分量确定总感测电流。

公开(公告)号：WO2014137432A1

公开(公告)日：2014-09-12

申请号：PCT/US2013/074225

申请日：2013-12-11

Applicant: DEERE & COMPANY

Inventor： SINGH, Brij, N. ,  FISK, Aron ,  CLEMENTS, Neal, D. ,  WIELAND, Andrew, D.

IPC: G01R15/20 ,  H02P23/00 ,  H02P6/16

CPC classification number: G01R15/181 ,  G01R15/20 ,  G01R19/0007 ,  G01R31/42

Abstract: A sensor (11) comprises an inductor (18) for sensing an alternating current signal component of an observed signal. The inductor (18) comprises a substrate, conductive traces associated with different layers of the substrate, and one or more conductive vias for interconnecting the plurality of conductive traces. A magnetic field sensor (20) senses a direct current signal component of the observed signal. A first filtering circuit (26) has a high-pass filter response. The first filtering circuit (26) is coupled to the inductor (18) to provide a filtered alternating current signal component. A second filtering circuit (28) has a low-pass filter response. The second filtering circuit (28) coupled to the magnetic field sensor (20) to provide a filtered direct current signal component. A sensor fusion circuit (30) determines an aggregate sensed current based on the filtered alternating current signal component and the filtered direct current signal component.

Abstract translation: 传感器（11）包括用于感测观测信号的交流信号分量的电感器（18）。 电感器（18）包括衬底，与衬底的不同层相关联的导电迹线以及用于互连多个导电迹线的一个或多个导电通孔。 磁场传感器（20）感测观测信号的直流信号分量。 第一滤波电路（26）具有高通滤波器响应。 第一滤波电路（26）耦合到电感器（18）以提供滤波的交流信号分量。 第二滤波电路（28）具有低通滤波器响应。 第二滤波电路（28）耦合到磁场传感器（20）以提供滤波的直流信号分量。 传感器融合电路（30）基于滤波的交流信号分量和滤波的直流信号分量来确定总感测电流。

公开(公告)号：WO2016130772A1

公开(公告)日：2016-08-18

申请号：PCT/US2016/017500

申请日：2016-02-11

Applicant: DEERE & COMPANY

Inventor： SINGH, Brij, N. ,  ROAN, Thomas ,  WIELAND, Andrew, D. ,  CLEMENTS, Neal, D.

IPC: H01L23/495

CPC classification number: H05K7/20927 ,  H01L23/473 ,  H01L23/49562 ,  H01L2023/4056 ,  H05K1/0209 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/09063

Abstract: An electronic assembly comprises a semiconductor device (48) that has conductive pads (66) on a semiconductor first side (72) and a metallic region (266) on a semiconductor second side (74) opposite the first side (72). A lead frame (16) provides respective separate terminals (54, 56) that are electrically and mechanically connected to corresponding conductive pads. A first heat sink (30) comprises a first component (37) having a mating side (62). A portion of the mating side (62) is directly bonded with the metallic region (266) of the semiconductor device (48). A circuit board has an opening for receiving the semiconductor device (48). The lead frame (16) extends outward toward the circuit board or a board first side of the circuit board.

Abstract translation: 电子组件包括在半导体第一侧（72）上具有导电焊盘（66）的半导体器件（48）和与第一侧（72）相对的半导体第二侧（74）上的金属区域（266）。 引线框架（16）提供相应的分别的端子（54,56），其电连接和机械连接到相应的导电焊盘。 第一散热器（30）包括具有配合侧（62）的第一部件（37）。 配合侧（62）的一部分与半导体器件（48）的金属区域（266）直接接合。 电路板具有用于接收半导体器件（48）的开口。 引线框架（16）向外朝向电路板或电路板的板第一侧向外延伸。

公开(公告)号：WO2014070493A1

公开(公告)日：2014-05-08

申请号：PCT/US2013/065835

申请日：2013-10-21

Applicant: DEERE & COMPANY

Inventor： WIELAND, Andrew, D. ,  OENICK, John, N. ,  HARMELINK, Gregory, K. ,  CLEMENTS, Neal D. ,  LARSEN, Kevin, B.

IPC: H02M1/44

CPC classification number: H05K7/20927

Abstract: An electrical connection assembly (10) includes a metal housing (12) and an electrical module (20) having a plurality of electrical components (26) mounted on a component base (28). The base is supported on the housing (12). A socket (40) conducts electrical current from a pin (44) of a cable (46) to the electrical components. A heat sink member (50) conducts heat directly from the socket (40) to the metal housing (12). An electrically insulating thermally conducting pad (60) is positioned between the housing (12) and an end of the heat sink (50) member. A current sensor (70) has a cylindrical body which surrounds a portion of the socket (40).

Abstract translation: 电连接组件（10）包括金属壳体（12）和具有安装在组件基座（28）上的多个电气部件（26）的电气模块（20）。 基座支撑在壳体（12）上。 插座（40）将电流从电缆（46）的引脚（44）传导到电气部件。 散热构件（50）将热量直接从插座（40）传导到金属外壳（12）。 电绝缘导热垫（60）位于壳体（12）和散热器（50）构件的端部之间。 电流传感器（70）具有围绕插座（40）的一部分的圆筒体。