公开(公告)号：WO2009137416A1

公开(公告)日：2009-11-12

申请号：PCT/US2009/042732

申请日：2009-05-04

Applicant: DIALIGHT CORPORATION ,  OESTERHELD, Klaus ,  JENKINS, Kenneth

Inventor： OESTERHELD, Klaus ,  JENKINS, Kenneth

IPC: H01L33/00

CPC classification number: F21K9/20 ,  F21W2111/00 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10106

Abstract: The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

Abstract translation: 本发明涉及一种表面贴装电路板指示器。 在一个实施例中，表面贴装电路板指示器包括具有至少一个发光二极管（LED）裸片，一个或多个迹线和至少一个透镜的印刷电路板（PCB），壳体包括沿着一侧的至少一个开口 壳体的周边，其中PCB耦合到壳体，使得至少一个LED管芯的光输出表面面向与至少一个开口相同的方向，以及耦合到壳体的至少一个对准销。

公开(公告)号：WO2016025609A1

公开(公告)日：2016-02-18

申请号：PCT/US2015/044873

申请日：2015-08-12

Applicant: DIALIGHT CORPORATION

Inventor： PECK, John Patrick ,  JENKINS, Kenneth ,  BOEGE, Samual David

IPC: H05K7/20

CPC classification number: F21V29/773 ,  F21S2/005 ,  F21V3/00 ,  F21V23/009 ,  F21V23/023 ,  F21V29/763 ,  F21V29/83 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: The present disclosure is directed to a light emitting diode (LED) light module. In one embodiment, the LED light module includes a plurality of light sections and a plurality of open sections formed by a plurality of heat sink fins between the plurality of light sections, wherein each one of the plurality of light sections is adjacent to two different light sections of the plurality of light sections.

Abstract translation: 本公开涉及一种发光二极管（LED）灯模块。 在一个实施例中，LED灯模块包括多个光部分和由多个光部分之间的多个散热片形成的多个开放部分，其中多个光部分中的每一个与两个不同的光线相邻 多个光部分的部分。

公开(公告)号：WO2014015021A2

公开(公告)日：2014-01-23

申请号：PCT/US2013/050861

申请日：2013-07-17

Applicant: DIALIGHT CORPORATION

Inventor： FETTERLY, Richard, H. ,  HEBBORN, Kevin, A. ,  VERDES, Anthony ,  JENKINS, Kenneth ,  MERRIAM, Virginia

IPC: H05B33/08

CPC classification number: H05B33/0854 ,  F21V23/003 ,  F21V29/77 ,  F21Y2115/10

Abstract: The present disclosure provides a method for powering a light fixture to provide a constant light output. In one embodiment, the method includes providing a current to one or more light emitting diodes (LEDs), monitoring an external ambient temperature and increasing the current to the one or more LEDs as the external ambient temperature rises to maintain the constant light output.

Abstract translation: 本公开提供了一种用于给灯具供电以提供恒定光输出的方法。 在一个实施例中，该方法包括向外部环境温度升高时向一个或多个发光二极管（LED）提供电流，监测外部环境温度并增加流向一个或多个LED的电流以维持恒定的光输出。 / p>

公开(公告)号：WO2013130628A1

公开(公告)日：2013-09-06

申请号：PCT/US2013/028047

申请日：2013-02-27

Applicant: DIALIGHT CORPORATION

Inventor： JENKINS, Kenneth ,  HEBBORN, Kevin A. ,  LEIB, William S. III ,  WEIMER, David

IPC: B29C45/37

CPC classification number: B29C39/10 ,  B29K2675/00 ,  B29K2683/00 ,  B29K2863/00 ,  H05K5/064

Abstract: The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.

Abstract translation: 本公开涉及一种用于封装电气模块的方法。 在一个实施例中，该方法包括将电气部件放置在灌封模具中，其中灌封模具包括匹配电气模块的一个或多个部件的拓扑结构的内部拓扑结构，用灌封化合物填充灌封模具并固化灌封 复合电气模块。