公开(公告)号：WO1981003734A1

公开(公告)日：1981-12-24

申请号：PCT/US1981000826

申请日：1981-06-19

Applicant: DIGITAL EQUIP CORP

Inventor： DIGITAL EQUIP CORP ,  OLSEN K ,  MCELROY J ,  HANNEMANN R ,  WEAVER B

IPC: H05K07/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/473 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/10409 ,  H05K2201/10416 ,  H01L2924/00

Abstract: Heat pin integrated circuit packaging apparatus for dissipating heat from electronic components into a cooling device. The apparatus comprises: a mounting element, such as a printed circuit board (10), having at least one cavity (40), for mounting the electronic components (1) in an electrical circuit; a heat pin (50), for thermally conducting heat away from the electronic component (1); a thermal planar frame (60) having at least one opening or position (90) for capturing a heat pin (50), the thermal planar frame having an inwardly facing surface (80) exposed to the cooling device; and an arrangement for detachably coupling the electronic component (1) to the heat pin (50) such that the electronic component (1) is electrically coupled to the printed circuit board (10) and thermally coupled to the heat pin (50). Thus heat generated by the electronic component (1), flows into the heat pin (50) and is dissipated into the thermal planar frame (60) for cooling by any of a variety of cooling devices. of the transfer ports.

Abstract translation: 热销集成电路封装装置，用于将热量从电子部件散热到冷却装置。 该装置包括：具有至少一个空腔（40）的用于将电子部件（1）安装在电路中的诸如印刷电路板（10）的安装元件; 热引脚（50），用于将热量从电子部件（1）导热; 具有用于捕获热销（50）的至少一个开口或位置（90）的热平面框架（60），所述热平面框架具有暴露于所述冷却装置的向内的表面（80）; 以及用于将电子部件（1）可拆卸地联接到热销（50）的装置，使得电子部件（1）电耦合到印刷电路板（10）并热耦合到热销（50）。 因此，由电子部件（1）产生的热量流入热销（50），并被散热到热平面框架（60）中，以便通过各种冷却装置中的任何一种进行冷却。 的传输端口。