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    SYSTEM AND METHOD FOR SELF-LEVELING HEAT SINK FOR MULTIPLE HEIGHT DEVICES
    3.
    发明申请
    SYSTEM AND METHOD FOR SELF-LEVELING HEAT SINK FOR MULTIPLE HEIGHT DEVICES 审中-公开
    用于多级高度装置的自流平散热器的系统和方法

    公开(公告)号：WO2005065273A2

    公开(公告)日：2005-07-21

    申请号：PCT/US2004/043420

    申请日：2004-12-22

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： EDWARDS, Darvin, R.

    IPC: H01L21/48 ,  H01L23/10 ,  H01L23/40 ,  H05K7/20

    CPC classification number: H01L23/4093 ,  H01L23/4012 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10T29/49133 ,  Y10T29/49169 ,  Y10T29/53265 ,  H01L2924/00

    Abstract: A self-leveling heat sink includes a spring-arm device having at least one aperture and at least one spring-arm is coupled to a substrate. The substrate has at least one package mounted thereon, so that when the spring-arm device is mounted to the substrate the at least one package passes through the at least one aperture. A heat sink operable to remove heat from the at least one package has at least one heat sink post operable to receive a heat sink clip located at the distal end of each of the at least one spring-arms. Each of the at least one spring-arms extending from an inside edge of the at least one aperture and operable to couple the heat sink to the at least one package.

    Abstract translation: 自调平散热器包括具有至少一个孔的弹簧臂装置，并且至少一个弹簧臂联接到基板。 基板上安装有至少一个封装，使得当弹簧臂装置安装到基板时，至少一个封装穿过至少一个孔。 可操作以从所述至少一个封装去除热量的散热器具有至少一个散热柱，所述至少一个散热柱可操作以接收位于所述至少一个弹簧臂中的每一个的远端处的散热片夹。 所述至少一个弹簧臂中的每一个从所述至少一个孔的内侧边缘延伸并且可操作以将所述散热器连接到所述至少一个包装。

    HEAT SINK ASSEMBLY
    4.
    发明申请
    HEAT SINK ASSEMBLY 审中-公开
    散热装置

    公开(公告)号：WO2005055318A1

    公开(公告)日：2005-06-16

    申请号：PCT/US2004/038737

    申请日：2004-11-17

    Applicant: INTEL CORPORATION ,  ULEN, Neal ,  SHIA, David ,  AHUJIA, Sandeep

    Inventor： ULEN, Neal ,  SHIA, David ,  AHUJIA, Sandeep

    IPC: H01L23/40

    CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Some disclosed embodiments include an integrated heat sink assembly having a standoff press disposed through the bottom of a bore in a support base of the heat sink, a screw disposed through the top of the bore in the support base of the heat sink, a spring adapted to bias the screw against the heat sink, wherein the screw and spring engage the standoff to attach the heat sink to the support base. The integrated heat sink assembly may be used to maintain contact between a heat sink and a processor on a motherboard. Other embodiments are disclosed and claimed.

    Abstract translation: 一些公开的实施例包括集成散热器组件，其具有穿过散热器的支撑底座中的孔的底部设置的支架压盖，穿过散热器的支撑基座中的孔的顶部设置的螺钉，适于 以将所述螺钉偏置抵靠所述散热器，其中所述螺钉和弹簧接合所述支座以将所述散热器附接到所述支撑基座。 集成散热器组件可用于保持散热器与主板上的处理器之间的接触。 公开和要求保护其他实施例。

    USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS
    5.
    发明申请
    USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS 审中-公开
    使用波峰焊接工艺来连接主板CHIPSET散热片

    公开(公告)号：WO03003455A3

    公开(公告)日：2003-08-21

    申请号：PCT/US0214870

    申请日：2002-05-10

    Applicant: INTEL CORP

    Inventor： HSIEH GEORGE

    IPC: H01L23/36 ,  H01L23/40 ,  H01L23/42 ,  H05K3/34 ,  H05K1/02 ,  H05K7/20

    CPC classification number: H01L23/4006 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/42 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H05K3/3447 ,  H05K3/3468 ,  Y10T29/49359

    Abstract: An electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

    Abstract translation: 一种用于从具有正面和背面的发热部件提取热量的电子装置和方法，所述正面布置在背面的对面，并且正面附接到包括多个孔的基板。 热界面材料设置在发热部件的背面上。 包括与基板中的多个孔相对应的多个引脚的散热器布置在热界面材料上方，使得引脚穿过孔布置。 当通过波峰焊接机的预加热器时，热界面材料熔化并湿润以在背面和散热器之间形成热耦合。 此外，当在波峰焊接机中通过焊接波时，销被焊接以在相应的销与衬底之间形成焊接接头，以锁定在预热热界面材料期间形成的热耦合以提供低成本 热解决方案。

    USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS
    6.
    发明申请
    USING THE WAVE SOLDERING PROCESS TO ATTACH MOTHERBOARD CHIPSET HEAT SINKS 审中-公开
    使用波形焊接工艺连接主板散热片

    公开(公告)号：WO2003003455A2

    公开(公告)日：2003-01-09

    申请号：PCT/US2002/014870

    申请日：2002-05-10

    Applicant: INTEL CORPORATION

    Inventor： HSIEH, George

    IPC: H01L23/40

    CPC classification number: H01L23/4006 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/42 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H05K3/3447 ,  H05K3/3468 ,  Y10T29/49359

    Abstract: An electronic device and method for extracting heat from a heat producing component having front and back sides, the front side is disposed across from the back side, and the front side is attached to a substrate including multiple holes. A thermal interface material is disposed over the back side of the heat producing component. A heat sink including multiple pins corresponding to the multiple holes in the substrate is disposed over the thermal interface material such that the pins are disposed through the holes. The thermal interface material melts and wets to form a thermal coupling between the back side and the heat sink when passed over pre-heaters of a wave soldering machine. Further, the pins are soldered to form solder joints between the respective pins and the substrate when passed over a solder wave in the wave soldering machine to lock-in the thermal coupling formed during the preheating of the thermal interface material to provide a low-cost thermal solution.

    Abstract translation: 一种用于从具有正面和背面的发热部件提取热量的电子装置和方法，其前侧从背侧横跨设置，并且将前侧附着到包括多个孔的基板。 热界面材料设置在发热部件的背面上。 在热界面材料上设置包括对应于衬底中的多个孔的多个销的散热器，使得销布置成穿过孔。 热界面材料熔化并润湿以在通过波峰焊机的预热器时在背面和散热器之间形成热耦合。 此外，当在波峰焊机中通过焊波时，引脚被焊接以在相应的引脚和基板之间形成焊接点，以锁定在热界面材料的预热期间形成的热耦合以提供低成本 热解决方案。

    HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR DEVICE
    7.
    发明申请
    HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的散热结构

    公开(公告)号：WO1992002117A1

    公开(公告)日：1992-02-06

    申请号：PCT/JP1991001006

    申请日：1991-07-26

    Applicant: FUJITSU LIMITED ,  YAMAJI, Hiroshi ,  KANNO, Takashi ,  SATO, Takashi ,  MAGOME, Riichi ,  HONGHO, Tomoyuki

    Inventor： FUJITSU LIMITED

    IPC: H05K07/20

    CPC classification number: H05K1/0204 ,  H01L23/40 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K2201/083 ,  H05K2201/10409 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00

    Abstract: By the structure, the heights of semiconductor devices mounted on a board are small. This raises the mounting density of boards ona shelf. The structure is detachably mounted on a board easily. An opening (1a) is provided in a circuit board (1), and a semiconductor device (2) is so mounted on the surface of the circuit board that the bottom face is in the opening. A heat transferring member (3, 11) is adhered to the bottom face of the semiconductor device. The other side of the member is exposed from the back side of the circuit board (1), passing through the opening (1a), and is adhered to a heat radiating plate (4) provided on the back of the board. Heat generated from the semiconductor device is transferred to the heat radiating plate (4) through the heat transferring member (3 or 11), and is radiated to the air from the surface of the plate (4) to cool the semiconductor device. The heat dissipating structure of the semiconductor device characterized in that, at least either one of the semiconductor device (2) and the heat radiating plate (4) is made of a magnetic material, and the both are adhered to the heat transferring member by the magnetic attraction of a permanent magnet (3 or 10) laid between the both.

    ELECTRICAL ISOLATOR DEVICE
    8.
    发明申请
    ELECTRICAL ISOLATOR DEVICE 审中-公开
    电气隔离器装置

    公开(公告)号：WO1991015103A1

    公开(公告)日：1991-10-03

    申请号：PCT/US1991001819

    申请日：1991-03-19

    Applicant: THE GUEST COMPANY, INC.

    Inventor： THE GUEST COMPANY, INC. ,  SOBOLESKI, Thomas, F.

    IPC: H05K07/20

    CPC classification number: H01L23/4006 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electrical isolator device (20) which comprises at least one heat sink (steel plate) (21), and a non-conductive housing (24) which partially encases the heat sink (21), such that at least one surface of the heat sink (21) is in contact with the non-conductive housing (24); whereby the surfaces of the heat sink (21) which are not in contact with the non-conductive housing (24) are exposed to the atmosphere to allow dissipation of heat therefrom.

    HOLDING DEVICE FOR AN INTEGRATED CIRCUIT CHIP
    9.
    发明申请
    HOLDING DEVICE FOR AN INTEGRATED CIRCUIT CHIP 审中-公开
    集成电路芯片的控制装置

    公开(公告)号：WO1983002527A1

    公开(公告)日：1983-07-21

    申请号：PCT/US1983000021

    申请日：1983-01-04

    Applicant: NCR CORPORATION

    Inventor： NCR CORPORATION ,  PERCHAK, Robert, Matthew

    IPC: H01L23/38

    CPC classification number: H01L23/4006 ,  G01R1/0458 ,  H01L23/38 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A holding device for an integrated circuit chip (60) includes a thermally conductive body (10) provided with a cavity (12) in which are arranged thermoelectric modules (14, 15) having located thereon a conductive pad (16) on which is mounted a further thermoelectric module (18) in contact with a thermally conductive block (20). The block (20) extends into a gas chamber (50) located in the body (10) and having upper and lower thermally insulative, slotted plates (24, 27). A socket (22) mounted on the lower plate (22) receives, via the slot in the upper plate (27), an integrated circuit chip (60). The thermoelectric modules (14, 15, 18) serve to rapidly heat and cool the chip. Dry nitrogen gas supplied via an inlet (30) to the gas chamber (50) is directed towards the chip (60) by inclined edges of the slot in the upper plate (27), thereby inhibiting condensation during cooling of the chip (60).

    Abstract translation: 一种用于集成电路芯片（60）的保持装置包括设置有空腔（12）的导热体（10），其中布置有热电模块（14,15），其上安装有导电焊盘（16），其上安装 与导热块（20）接触的另一个热电模块（18）。 块（20）延伸到位于主体（10）中的气室（50）中，并具有上和下热绝缘的开槽板（24,27）。 安装在下板（22）上的插座（22）经由上板（27）中的槽接收集成电路芯片（60）。 热电模块（14,15,18）用于快速加热和冷却芯片。 经由入口（30）供应到气室（50）的干燥氮气通过上板（27）中的槽的倾斜边缘被引向芯片（60），由此在芯片（60）冷却期间抑制冷凝， 。

    HEAT PIN INTEGRATED CIRCUIT PACKAGING
    10.
    发明申请
    HEAT PIN INTEGRATED CIRCUIT PACKAGING 审中-公开
    热引脚集成电路封装

    公开(公告)号：WO1981003734A1

    公开(公告)日：1981-12-24

    申请号：PCT/US1981000826

    申请日：1981-06-19

    Applicant: DIGITAL EQUIP CORP

    Inventor： DIGITAL EQUIP CORP ,  OLSEN K ,  MCELROY J ,  HANNEMANN R ,  WEAVER B

    IPC: H05K07/20

    CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L23/4006 ,  H01L23/473 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/10409 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: Heat pin integrated circuit packaging apparatus for dissipating heat from electronic components into a cooling device. The apparatus comprises: a mounting element, such as a printed circuit board (10), having at least one cavity (40), for mounting the electronic components (1) in an electrical circuit; a heat pin (50), for thermally conducting heat away from the electronic component (1); a thermal planar frame (60) having at least one opening or position (90) for capturing a heat pin (50), the thermal planar frame having an inwardly facing surface (80) exposed to the cooling device; and an arrangement for detachably coupling the electronic component (1) to the heat pin (50) such that the electronic component (1) is electrically coupled to the printed circuit board (10) and thermally coupled to the heat pin (50). Thus heat generated by the electronic component (1), flows into the heat pin (50) and is dissipated into the thermal planar frame (60) for cooling by any of a variety of cooling devices. of the transfer ports.

    Abstract translation: 热销集成电路封装装置，用于将热量从电子部件散热到冷却装置。 该装置包括：具有至少一个空腔（40）的用于将电子部件（1）安装在电路中的诸如印刷电路板（10）的安装元件; 热引脚（50），用于将热量从电子部件（1）导热; 具有用于捕获热销（50）的至少一个开口或位置（90）的热平面框架（60），所述热平面框架具有暴露于所述冷却装置的向内的表面（80）; 以及用于将电子部件（1）可拆卸地联接到热销（50）的装置，使得电子部件（1）电耦合到印刷电路板（10）并热耦合到热销（50）。 因此，由电子部件（1）产生的热量流入热销（50），并被散热到热平面框架（60）中，以便通过各种冷却装置中的任何一种进行冷却。 的传输端口。

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