Abstract:
A composition for surface treatment comprises a siloxane polymer and a vehicle. The composition forms layers that are easy to clean and which have excellent physical properties, including smudge and stain resistance. In addition, durability and coefficient of friction of the layers may be selectively controlled based on the composition. A surface-treated article and methods of preparing the surface-treated article with the composition are also disclosed.
Abstract:
A composition comprises a perfluorinated solvent having at least one CF3 group selected from a perfluoropolyether solvent having a boiling point temperature of at least 120 °C at atmospheric pressure and a nitrogen-containing perfluorinated solvent. The composition further comprises a polyfluoropolyether silane. The composition forms layers having excellent physical properties, including durability and appearance, in addition to stain and smudge resistance.
Abstract:
A composition for surface treatment comprises a polyfluoropolyether silane, a solvent, and an additive compound for improving appearance and durability of layers formed from the composition. The layers formed from the surface treatment composition have excellent physical properties, including smudge and stain resistance, as well as durability.
Abstract:
A gel having improved thermal stability is the hydro silylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon- bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a heated reaction product of iron acetylacetonate. The iron acetylacetonate is present prior to heating in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel is formed using a method that includes the steps of (I) heating the iron acetylacetonate to form the (D) heated reaction product of the iron acetylacetonate and (II) combining (A), (B), (C) and (D) to effect the hydrosilylation reaction of (A) and (B) in the presence of (C) and (D) to form the gel.
Abstract:
A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225 °C for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm.
Abstract:
A curable and patternable ink, a method of using this ink as part of a structure that performs a function in an electronic device, and a soft lithographic method for forming said structure on a substrate for use within the electronic device is disclosed. The curable and patternable ink generally comprises a first portion defined by structural units of (R)SiO 3/2 ; a second portion defined by structural units of (R) 2 SiO 2/2 ; and an organic solvent. Alternatively, the ink further comprises structural units (R) 3 SiO 1/2 or SiO 4/2 . The R group is independently selected to be an aryl group, a methyl group, or a cross-linkable group with the number of aryl groups being present in an amount that ranges from at least one aryl group up to 20 mole %. The patternable ink may be applied to a substrate using a soft lithographic process with good reproducibility of the applied pattern.
Abstract:
A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.
Abstract:
A method of manufacturing an encapsulated semiconductor device comprising a semiconductor device encapsulated on at least one major surface with a cured silicon body comprising a cured silicone adhesive composition to give the encapsulated semiconductor device; wherein the cured silicone adhesive composition has a storage modulus at 25° C. of from 0.1 GPa to 10 GPa and has a glass transition temperature of from 0° C. to 80° C.