Abstract:
A flexible printed circuit board (FPCB) for fiber optic modules (200) includes a board with multiple bends, forming a structure with sides (306) and a bottom (303). The traces (204) in the FPCB traverse from the opto-electronic chips (210), through the sides of the FPCB, to the module (200) interconnects at the bottom (303). The multi-fold structure allows the FPCB to support a higher number of traces (204) than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips (210) at the front of the fiber-optic module (200), thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces (204), resulting in improved signal integrity over conventional multi-layer FPCB's.