HIGH DENSITY FIBER-OPTIC MODULE WITH MULTI-FOLD FLEXIBLE CIRCUIT
    1.
    发明申请
    HIGH DENSITY FIBER-OPTIC MODULE WITH MULTI-FOLD FLEXIBLE CIRCUIT 审中-公开
    具有多层柔性电路的高密度光纤模块

    公开(公告)号:WO2004032203A3

    公开(公告)日:2004-05-27

    申请号:PCT/US0322461

    申请日:2003-07-16

    Applicant: EMCORE CORP

    Abstract: A flexible printed circuit board (FPCB) for fiber optic modules (200) includes a board with multiple bends, forming a structure with sides (306) and a bottom (303). The traces (204) in the FPCB traverse from the opto-electronic chips (210), through the sides of the FPCB, to the module (200) interconnects at the bottom (303). The multi-fold structure allows the FPCB to support a higher number of traces (204) than conventional single-fold FPCB's, and it allows the fanning out of signal traces from the opto-electronic and electronic chips (210) at the front of the fiber-optic module (200), thereby reducing the crosstalk between the traces. This higher number is provided with a FPCB that features a single insulating layer and without the need to criss-cross the traces (204), resulting in improved signal integrity over conventional multi-layer FPCB's.

    Abstract translation: 用于光纤模块(200)的柔性印刷电路板(FPCB)包括具有多个弯曲的板,形成具有侧面(306)和底部(303)的结构。 在FPCB中穿过FPCB的侧面的FPCB中的走线(204)在底部(303)互连。 多折叠结构允许FPCB支持比常规单折FPCB更多数量的迹线(204),并且其允许从在前面的光电子和电子芯片(210)的信号迹线扇出 光纤模块(200),从而减少迹线之间的串扰。 该更高数量的FPCB具有特征在于单个绝缘层并且不需要跨越迹线(204)的FPCB,导致比常规多层FPCB更好的信号完整性。

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