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    METHOD AND APPARATUS TO PREVENT LASER KINK FAILURES
    1.
    发明申请
    METHOD AND APPARATUS TO PREVENT LASER KINK FAILURES 审中-公开

    公开(公告)号：WO2019125919A1

    公开(公告)日：2019-06-27

    申请号：PCT/US2018/065541

    申请日：2018-12-13

    申请人： CISCO TECHNOLOGY, INC.

    发明人： AHMAD, Mudasir ,  XIE, Weidong ,  PANG, Yaoyu ,  LIU, Chiyu ,  WANG, Qiang

    IPC分类号： H01S5/024

    CPC分类号： H01S5/02256 ,  H01S5/024 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/10121

    摘要： Systems, devices, methods, and computer-readable media for preventing laser kink failures. A laser diode device can include one or more laser diodes configured to emit electromagnetic radiation coherently. The laser diode device can also include one or more submounts upon which the one or more laser diodes are mounted. The one or more submounts can include one or more through vias including one or more fill materials different from a material of the one or more submounts. Further, one or more properties of the one or more through vias in the one or more submounts can be selected to reduce an amount of mismatch between an effective coefficient of thermal expansion of the one or more laser diodes and an effective coefficient of thermal expansion of the one or more submounts.

    HIGH THERMAL CONDUCTIVITY REGION FOR OPTOELECTRONIC DEVICES
    4.
    发明申请
    HIGH THERMAL CONDUCTIVITY REGION FOR OPTOELECTRONIC DEVICES 审中-公开
    用于光电子器件的高导热率区域

    公开(公告)号：WO2018022398A1

    公开(公告)日：2018-02-01

    申请号：PCT/US2017/042964

    申请日：2017-07-20

    申请人： MICROSOFT TECHNOLOGY LICENSING, LLC

    发明人： NALLA, Ravi Kiran ,  PRICE, Raymond Kirk

    IPC分类号： H05K1/02 ,  H05K1/18

    CPC分类号： H05K1/0206 ,  G02B6/4267 ,  G02B6/428 ,  G02B6/4283 ,  H05K1/0204 ,  H05K1/0274 ,  H05K1/183 ,  H05K3/32 ,  H05K3/4697 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10416 ,  H05K2201/2054

    摘要： This document describes techniques and apparatuses that implement a high thermal conductivity region for optoelectronic devices. In some embodiments, a printed circuit board (PCB) includes a high thermal conductivity region that extends through the PCB. The high thermal conductivity region has first and second surfaces that are approximately coplanar with exterior layers of the PCB. A side-emitting optoelectronic device is mounted to the first surface of the high thermal conductivity region via conductive material that enables conduction of the device's heat into the high thermal conductivity region. The high thermal conductivity region can then transfer the heat away from the device and toward the second surface of the high thermal conductivity region, thereby improving the device's thermal performance.

    摘要翻译： 本文描述了实现用于光电子器件的高导热率区域的技术和设备。 在一些实施例中，印刷电路板（PCB）包括延伸穿过PCB的高导热率区域。 高导热率区域具有与PCB的外层大致共面的第一和第二表面。 侧发射光电子器件通过导电材料安装到高导热率区域的第一表面，该导电材料能够将器件的热量传导到高导热率区域。 然后，高导热率区域可以将热量从器件传递到高导热率区域的第二表面，从而改善器件的热性能。

    OPTICAL PRINTED CIRCUIT BOARD WITH POLYMER ARRAY STITCH
    5.
    发明申请
    OPTICAL PRINTED CIRCUIT BOARD WITH POLYMER ARRAY STITCH 审中-公开
    带聚合物阵列针的光学印刷电路板

    公开(公告)号：WO2017189955A1

    公开(公告)日：2017-11-02

    申请号：PCT/US2017/030045

    申请日：2017-04-28

    申请人： ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA

    发明人： KOCH, Thomas L. ,  NORWOOD, Robert ,  PAU, Stanley K. ,  PEYGHAMBARIAN, Nasser

    IPC分类号： H05K1/02 ,  G02B6/42 ,  G02B6/12

    CPC分类号： H05K1/0274 ,  G02B6/12 ,  G02B6/43 ,  H05K1/0393 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/10121

    摘要： A flexible polymer waveguide array structure serves as a stitch or jumper on an optical printed circuit board (OPCB). The flexible polymer waveguide array structure can be attached to the OPCB so that it can provide a chip-to-OPCB optical connection. The waveguide(s) in the flexible polymer waveguide array structure may be prefabricated before the flexible polymer waveguide array structure is attached to the OPCB. Alternatively, the waveguides may be fabricated after the flexible polymer waveguide array structure has been attached to the OPCB. The waveguide(s) may be subsequently formed using a printing process such as photolithography. As a consequence of forming the waveguide(s) after attachment of the flexible polymer waveguide array to the OPCB, the precision in the lateral alignment that is required when placing the flexible polymer waveguide array structure on the OPCB is generally significantly less than is required when the waveguide(s) are prefabricated.

    摘要翻译： 柔性聚合物波导阵列结构用作光学印刷电路板（OPCB）上的针脚或跨接线。 柔性聚合物波导阵列结构可以连接到OPCB，以便它可以提供芯片到OPCB光学连接。 柔性聚合物波导阵列结构中的波导可以在柔性聚合物波导阵列结构附接到OPCB之前被预制。 或者，可以在柔性聚合物波导阵列结构已经附接到OPCB之后制造波导。 随后可以使用诸如光刻的印刷工艺形成波导。 由于在将柔性聚合物波导阵列附接到OPCB之后形成波导（一个或多个）的结果，当将柔性聚合物波导阵列结构放置在OPCB上时所需的横向对准精度通常显着低于当 波导是预制的。

    摄像头组件以及电子设备
    6.
    发明申请
    摄像头组件以及电子设备 审中-公开

    公开(公告)号：WO2017148148A1

    公开(公告)日：2017-09-08

    申请号：PCT/CN2016/101303

    申请日：2016-09-30

    申请人： 北京小米移动软件有限公司

    发明人： 吴锋辉 ,  颜克胜

    IPC分类号： G06F1/16

    CPC分类号： H04N5/2252 ,  G03B5/00 ,  G03B17/02 ,  G03B17/12 ,  G03B2205/0092 ,  G03B2217/002 ,  G06F1/1624 ,  G06F1/1677 ,  G06F1/1683 ,  G06F1/1686 ,  H04M1/0237 ,  H04M1/0264 ,  H04N5/2253 ,  H05K1/0283 ,  H05K1/11 ,  H05K2201/055 ,  H05K2201/10121

    摘要： 一种摄像头组件(10,20,520)以及电子设备(50)，属于机械设计领域。所述摄像头组件(10,20,520)包括：壳体(110,210)、设置于壳体(110,210)内部的摄像头部件(120,220)和PUSH-PUSH部件(130,230)。通过将PUSH-PUSH部件(130,230)的一端与壳体(110,210)相连，另一端与摄像头部件(120,220)相连，壳体(110,210)内形成有供摄像头部件(120,220)滑动的滑槽(140,250)，摄像头部件(120,220)用于在接收到按压操作时，由PUSH-PUSH部件(130,230)的导引在外露于壳体(110,210)的第一状态和内缩于壳体(110,210)的第二状态之间进行切换；解决了相关技术中摄像头组件(10,20,520)设置于电子设备(50)的背面，由于电子设备(50)的背面经常与桌面接触而导致摄像头组件(10,20,520)的镜头很容易被磨损的问题；达到了摄像头组件(10,20,520)的镜头可以在外露于壳体(110,210)和内缩于壳体(110,210)的状态间切换，减少对镜头的磨损的效果。

    CAMERA MODULE DESIGN WITH LEAD FRAME AND PLASTIC MOULDING
    9.
    发明申请
    CAMERA MODULE DESIGN WITH LEAD FRAME AND PLASTIC MOULDING 审中-公开
    相机模块设计与引导框架和塑料模制

    公开(公告)号：WO2017024257A1

    公开(公告)日：2017-02-09

    申请号：PCT/US2016/045861

    申请日：2016-08-05

    申请人： APPLE INC.

    发明人： YANG, Annabelle ,  TOC, Howell John Chua ,  VENKATESAPPA, Prakash ,  KANTH, Kolan Ravi

    IPC分类号： H04N5/225 ,  H05K1/18

    CPC分类号： H04N5/2252 ,  H04N5/2253 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/2009 ,  H05K2203/1316

    摘要： A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

    摘要翻译： 相机模块包括图像传感器，柔性印刷电路，其具有固定到图像传感器的第一侧的第一侧，固定到图像传感器的第二侧的多个金属引线，以及用于将光引导到 图像传感器通过连接到引线和柔性印刷电路的包覆成型中的一个或多个连接到图像传感器。 图像传感器的第一侧是与图像传感器的第二侧相对的一侧。 引线提供图像传感器和柔性印刷电路中的引线之间的连接。