Abstract:
An electronic module is presented. The electronic module includes one or more electronic devices (104) and a first bus (106) electrically coupled to at least one of the one or more electronic devices. The first bus includes a first electrically conductive plate (108), a second electrically conductive plate (110), and a first electrically insulating plate (112) disposed between the first electrically conductive plate and the second electrically conductive plate, where in a first portion of the first bus, the first electrically insulating plate is disposed such that the first electrically insulating plate is not in direct physical contact with at least one of the first electrically conductive plate and the second electrically conductive plate to form at least one cavity (118) between the first electrically insulating plate and at least one of the first electrically conductive plate and the second electrically conductive plate. An electronic module assembly having low loop inductance is also presented.
Abstract:
A feedthrough includes a first printed circuit board, a first flexible conductive element coupled to and extending from an edge of the first printed circuit board, a second printed circuit board, and a second flexible conductive element coupled to and extending from an edge of the second printed circuit board.
Abstract:
A shielded direct current link ("DC link") busbar includes a central planar element that includes a first surface and a second surface axially opposed to the first surface. The shielded DC link busbar further includes a first conductive lamina disposed over the first surface and a second conductive lamina disposed over the second surface. Further, the first conductive lamina and the second conductive lamina are electrically coupled.