POLYPHOSPHAZENE BINDER RESINS FOR PHOTORESISTS
    3.
    发明申请
    POLYPHOSPHAZENE BINDER RESINS FOR PHOTORESISTS 审中-公开
    聚对苯二甲酸丁二酯树脂

    公开(公告)号:WO1993012468A1

    公开(公告)日:1993-06-24

    申请号:PCT/US1992010836

    申请日:1992-12-15

    CPC classification number: C08G79/025 G03F7/0233 Y10S430/106

    Abstract: This invention relates to novel radiation sensitive compositions. More particularly the invention relates to photoresists containing phosphorus and nitrogen linked polymers; i.e., polyphosphazenes, useful in the preparation of a relief pattern on a substrate; e.g., a silicon wafer or aluminum plate. The polyphosphazenes of this invention can be synthesized by the condensation of N-trimethylsilyalkoxyphosphorimides. Radiation sensitive positive photoresist compositions of the invention can be developed in aqueous base developer or organic solvent developer. The base developer dissolution properties of the composition can be controlled by incorporating carboxylate groups into the polyphosphazene. The polyphosphazenes utilized in this invention have good solubility properties in various organic solvents and also have good mechanical, electrical, adhesion and thermal properties.

    NOVOLAK RESIN BLENDS FOR PHOTORESIST APPLICATIONS
    4.
    发明申请
    NOVOLAK RESIN BLENDS FOR PHOTORESIST APPLICATIONS 审中-公开
    NOVOLAK树脂用于光电子学应用

    公开(公告)号:WO1994014893A1

    公开(公告)日:1994-07-07

    申请号:PCT/US1993012407

    申请日:1993-12-20

    CPC classification number: G03F7/0236 C08G8/08 C08L61/06 C08L61/04

    Abstract: The present invention relates to a water insoluble, aqueous alkali soluble novolak resin blend, wherein the resin blend comprises two novolaks having dissimilar relative molecular weights and similar dissolution rates, a process for producing such a resin blend, a photoresist containing such a resin blend and a method for producing a semi-conductor device utilizing such a photoresist.

    Abstract translation: 本发明涉及一种不溶于水的碱溶性酚醛清漆树脂混合物,其中树脂共混物包含具有不同相对分子量和相似溶解速率的两种酚醛清漆,制备这种树脂共混物的方法,含有这种树脂共混物的光致抗蚀剂, 一种利用这种光致抗蚀剂制造半导体器件的方法。

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