Abstract:
The present invention provides a process for producing bottom anti-reflective coating compositions having a very low level of metal ions utilizing specially treated anion exchange resins. The present invention also provides a method for producing semiconductor devices by producing photoimages on a substrate using such bottom anti-reflective coating compositions.
Abstract:
The invention relates to the use of thermally stable, water-insoluble and alkali-soluble polyalkylated phenolic resins in photosensitive compositions, where the polyalkylated resin is a reaction product of a carboxylic acid and at least one substituted phenyl carbinol. The invention also relates to the use of these photosensitive compositions in manufacturing semiconductor devices.
Abstract:
This invention relates to novel radiation sensitive compositions. More particularly the invention relates to photoresists containing phosphorus and nitrogen linked polymers; i.e., polyphosphazenes, useful in the preparation of a relief pattern on a substrate; e.g., a silicon wafer or aluminum plate. The polyphosphazenes of this invention can be synthesized by the condensation of N-trimethylsilyalkoxyphosphorimides. Radiation sensitive positive photoresist compositions of the invention can be developed in aqueous base developer or organic solvent developer. The base developer dissolution properties of the composition can be controlled by incorporating carboxylate groups into the polyphosphazene. The polyphosphazenes utilized in this invention have good solubility properties in various organic solvents and also have good mechanical, electrical, adhesion and thermal properties.
Abstract:
The present invention relates to a water insoluble, aqueous alkali soluble novolak resin blend, wherein the resin blend comprises two novolaks having dissimilar relative molecular weights and similar dissolution rates, a process for producing such a resin blend, a photoresist containing such a resin blend and a method for producing a semi-conductor device utilizing such a photoresist.
Abstract:
A process for producing a water insoluble, aqueous alkali soluble novolak resin, process for producing a photoresist containing such a novolak resin and a method for producing a semiconductor device using such a photoresist.