公开(公告)号：WO2019125587A1

公开(公告)日：2019-06-27

申请号：PCT/US2018/055516

申请日：2018-10-11

申请人： HRL LABORATORIES, LLC

发明人： HERRAULT, Florian G. ,  BROWN, David ,  SHARIFI, Hasan ,  WONG, Joel C. ,  REGAN, Dean C. ,  TANG, Yan ,  FUNG, Helen

IPC分类号： H01L25/065 ,  H01L23/482 ,  H01L23/13 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L23/5389 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/4827 ,  H01L24/27 ,  H01L25/50 ,  H01L2221/68354

摘要： An electronic assembly, comprising a carrier wafer having a top wafer surface and a bottom wafer surface; an electronic integrated circuit being formed in the carrier wafer and comprising a wafer contact pad on the top wafer surface; said carrier wafer comprising a through-wafer cavity joining the top and bottom wafer surfaces; a component chip having a component chip top surface, a component chip bottom surface and component chip side surfaces, the component chip being held in said through-wafer cavity by an attachment material attaching at least one wall of the through-wafer cavity to at least one of the component chip bottom surface and a component chip side surface; said component chip comprising at least one component contact pad on said component chip top substrate; a first conductor connecting said wafer contact pad and said component contact pad.