公开(公告)号：WO2015038367A3

公开(公告)日：2015-05-07

申请号：PCT/US2014053677

申请日：2014-09-02

Applicant: INNOVATIVE MICRO TECHNOLOGY

Inventor： GUDEMAN CHRISTOPHER ,  SEN PROSENJIT

IPC: H01L21/316 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L21/486 ,  B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L31/02167 ,  H01L31/03529 ,  H01L31/052 ,  H01L31/068 ,  H01L2924/0002 ,  Y02E10/547 ,  H01L2924/00

Abstract: A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.

Abstract translation: 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并且熔化玻璃使其流入形成在模板衬底中的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。