公开(公告)号：WO2017172114A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/018731

申请日：2017-02-21

申请人： INTEL CORPORATION

发明人： PIHLMAN, Jeffrey A. ,  TOMLIN, John C.

IPC分类号： H05K1/11

CPC分类号： H05K1/181 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/50 ,  H01R12/727 ,  H05K1/0262 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/113 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K3/10 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10037 ,  H05K2201/10734 ,  H05K2201/2036

摘要： IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

摘要翻译： IC装置组件包括安装到进一步容纳功率吸收装置和电源装置的主PCB（即，主板）的功率输送总线板。 作为辅助PCB的总线板可以表面安装在主电路板背面，与安装在主电路板正面的电源和接收器设备相对。 总线板仅需要被确定尺寸以桥接主PCB的第一和第二背侧区域之间的长度，所述第一和第二背侧区域进一步耦合到功率吸收器件所使用的一部分正面焊盘。 次级PCB可以专用于在源设备和接收设备之间传送功率，并且包括例如可以由多个重量级金属化层形成的短而宽的迹线。