DEVICE AND METHOD FOR PROCESSING WAFER SHAPED ARTICLES
    2.
    发明申请
    DEVICE AND METHOD FOR PROCESSING WAFER SHAPED ARTICLES 审中-公开
    用于处理波形形状的装置和方法

    公开(公告)号:WO2013076647A1

    公开(公告)日:2013-05-30

    申请号:PCT/IB2012/056563

    申请日:2012-11-20

    摘要: A device for processing wafer-shaped articles, comprises a chuck adapted to receive a wafer shaped article and a collector surrounding the chuck. The collector comprises a base and a plurality of divider walls, as well as a plurality of nested partitions surrounding the chuck. Each of the plurality of nested partitions is positioned on a corresponding one of the plurality of divider walls, and each of the plurality of nested partitions is vertically movable so as to define a plurality of separate process regions within the collector depending on the vertical position of each of the plurality of nested partitions. At least one of the divider walls comprises an internal exhaust conduit communicating with an exhaust duct underlying the divider wall.

    摘要翻译: 一种用于处理晶片形物品的装置,包括适于容纳晶片成形制品的卡盘和围绕卡盘的收集器。 收集器包括基座和多个分隔壁,以及围绕卡盘的多个嵌套分隔件。 多个嵌套分区中的每一个位于多个分隔壁中的对应的一个分隔壁上,并且多个嵌套分区中的每一个可垂直移动,以便在收集器内根据垂直位置定义多个分离的处理区域 多个嵌套分区中的每一个。 分隔壁中的至少一个包括与分隔壁下方的排气管道连通的内部排气管道。