PAD RAISING MECHANISM IN WAFER POSITIONING PEDESTAL FOR SEMICONDUCTOR PROCESSING
    1.
    发明申请
    PAD RAISING MECHANISM IN WAFER POSITIONING PEDESTAL FOR SEMICONDUCTOR PROCESSING 审中-公开
    半导体工艺晶片定位基座中的垫升机理

    公开(公告)号:WO2018071598A1

    公开(公告)日:2018-04-19

    申请号:PCT/US2017/056225

    申请日:2017-10-11

    IPC分类号: C23C16/00 H01L21/00

    摘要: An assembly used in a process chamber for depositing a film on a wafer. A pedestal assembly includes a pedestal movably mounted to a main frame. A lift pad rests upon the pedestal and moves with the pedestal assembly. A raising mechanism separates the lift pad from the pedestal, and includes a hard stop fixed to the main frame, a roller attached to the pedestal assembly, a slide moveably attached to the pedestal assembly, a lift pad bracket interconnected to the slide and a pad shaft extending from the lift pad, and a lever rotatably attached to the lift pad bracket. The lever rests on the roller when not engaged with the upper hard stop. When the pedestal assembly moves upwards, the lever rotates about a pin when engaging the upper hard stop and roller, and separates the lift pad from the pedestal by a process rotation displacement.

    摘要翻译: 用于在晶片上沉积膜的处理室中使用的组件。 底座组件包括可移动地安装到主框架的底座。 升降垫放置在基座上并与基座组件一起移动。 升降机构将升降垫与基座分开,并且包括固定到主框架的硬止动件,附接到基座组件的滚轮,可移动地附接到基座组件的滑动件,互连到滑动件的升降垫支架和垫 从升降垫延伸的轴以及可旋转地附接到升降垫支架的杆。 当不与上部硬止动器接合时,杠杆靠在滚轮上。 当底座组件向上移动时,杠杆在接合上部硬止动件和滚筒时围绕销旋转,并且通过处理旋转位移将提升垫与底座分开。

    基板収納容器
    2.
    发明申请
    基板収納容器 审中-公开
    基材储存容器

    公开(公告)号:WO2018034101A1

    公开(公告)日:2018-02-22

    申请号:PCT/JP2017/026201

    申请日:2017-07-20

    IPC分类号: H01L21/673 B65D85/86

    摘要: 搬送部品の装着力を高めた基板収納容器を提供すること。 蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体20と、容器本体20に着脱自在に取付けられる搬送部品30と、を備え、取付機構40が、容器本体20の開口部側の第1取付部40Aと、開口部から離れる側の第2取付部40Bとを含むこと。また、搬送部品30は、取付機構40に係合する被係合部を有し、被係合部は、所定の方向に変位して係合する第1被係合部36と、所定の方向とは異なる方向に変位して係合する第2被係合部37とを含むこと。

    摘要翻译: 提供具有增强的传送部件的安装力的基板存储容器。 它具有由设置有多个容器主体20能够容纳所述衬底的盖子封闭的开口,所述输送部件30可拆卸地连接到容器主体20中,安装机构40,容器主体20 在第一安装部40A的开口侧具有第一安装部40A,在远离开口部的一侧具有第二安装部40B。 另外,输送部件30具有与安装机构40卡合的被卡合部,被卡合部具有向规定方向位移并卡合的第一被卡合部36, 并且,第二被卡合部37向与第二被卡合部37不同的方向移位卡合。

    WAFER PROCESSOR DOOR INTERFACE
    3.
    发明申请
    WAFER PROCESSOR DOOR INTERFACE 审中-公开
    晶片处理器门接口

    公开(公告)号:WO2017218152A1

    公开(公告)日:2017-12-21

    申请号:PCT/US2017/034281

    申请日:2017-05-24

    IPC分类号: H01L21/67 H01L21/677

    摘要: A processing system includes at least one processor having a tank for holding a process liquid. A clean assembly above the tank is provided with an upper housing having at least one upper housing spray nozzle, and a lower housing having at least one lower housing spray nozzle, with the lower housing below the upper housing. A door between the upper housing and the lower housing is movable via an actuator from an open position wherein a load port through the clean assembly is open, to a closed position wherein the load port is closed off. The door largely prevents liquids used in the upper housing from moving down into the process liquid in the tank, and may also improve gas flow in the system.

    摘要翻译: 处理系统包括至少一个处理器,处理器具有用于保存处理液的罐。 箱体上方的干净组件设置有具有至少一个上部壳体喷嘴的上部壳体和具有至少一个下部壳体喷嘴的下部壳体,并且下部壳体位于上部壳体下方。 上部壳体和下部壳体之间的门可通过致动器从其中穿过清洁组件的装载口打开的打开位置移动到关闭装载口的关闭位置。 门大大地防止了上部外壳中使用的液体向下移动到储罐中的处理液体中,并且还可以改善系统中的气体流动。

    WAFER HANDLING ASSEMBLY
    5.
    发明申请
    WAFER HANDLING ASSEMBLY 审中-公开
    晶圆处理组件

    公开(公告)号:WO2017151323A1

    公开(公告)日:2017-09-08

    申请号:PCT/US2017/018180

    申请日:2017-02-16

    IPC分类号: H01L21/687 H01L21/683

    摘要: A wafer handling assembly comprising a center hub supporting a vertical non-contact lifting head and at least one radially extending and radially retracting wafer engaging mechanism having a surface to engage a wager at a peripheral edge of the wafer, where the peripheral edge is a corner edge or a side edge. In some implementations, the wafer engaging mechanism has a foot on which the wafer edge is supported. The lifting head may be vertically moveable in respect to the assembly.

    摘要翻译: 一种晶片搬运组件,包括支撑垂直非接触式升降头的中心轮毂和至少一个径向延伸且径向缩回的晶片接合机构,所述晶片接合机构具有在晶片的外围边缘处与吸嘴接合的表面 ,其中外围边缘是角部边缘或侧边缘。 在一些实施方式中,晶片接合机构具有脚,晶片边缘被支撑在脚上。 升降头可以相对于组件垂直移动。

    METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS TESTER
    6.
    发明申请
    METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS TESTER 审中-公开
    用于电子测试仪中器件的热控制的方法和系统

    公开(公告)号:WO2017120514A1

    公开(公告)日:2017-07-13

    申请号:PCT/US2017/012597

    申请日:2017-01-06

    申请人: AEHR TEST SYSTEMS

    IPC分类号: G01R1/04

    摘要: A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.

    摘要翻译: 提供了一种测试器设备。 槽组件可拆卸地安装到框架上。 每个槽组件允许对插入到槽组件中的相应筒的单独加热和温度控制。 框架限定闭环空气路径,并且加热器和冷却器位于闭环空气路径中以用空气冷却或加热筒。 当其他墨盒处于被测试的各个阶段或处于不同阶段的温度升高时,可以插入或移除单个墨盒。

    SELF-CENTERING WAFER CARRIER SYSTEM FOR CHEMICAL VAPOR DEPOSITION
    7.
    发明申请
    SELF-CENTERING WAFER CARRIER SYSTEM FOR CHEMICAL VAPOR DEPOSITION 审中-公开
    用于化学蒸气沉积的自中心波浪载体系统

    公开(公告)号:WO2016209647A1

    公开(公告)日:2016-12-29

    申请号:PCT/US2016/037022

    申请日:2016-06-10

    摘要: A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge. The wafer carrier at least partially supports a wafer for CVD processing. A rotating tube comprises an edge that supports the wafer carrier during processing. An edge geometry of the wafer carrier and an edge geometry of the rotating tube being chosen to provide a coincident alignment of a central axis of the wafer carrier and a rotation axis of the rotating tube during process at a desired process temperature.

    摘要翻译: 用于化学气相沉积(CVD)反应器的自定心晶片载体系统包括具有边缘的晶片载体。 晶片载体至少部分地支撑用于CVD处理的晶片。 旋转管包括在处理期间支撑晶片载体的边缘。 晶片载体的边缘几何形状和旋转管的边缘几何形状被选择为在期望的工艺温度下处理期间提供晶片载体的中心轴线和旋转管的旋转轴线的重合对准。

    PROCESSING CHAMBER
    9.
    发明申请
    PROCESSING CHAMBER 审中-公开
    加工室

    公开(公告)号:WO2016109063A1

    公开(公告)日:2016-07-07

    申请号:PCT/US2015/062390

    申请日:2015-11-24

    摘要: Embodiments of the present disclosure provide a processing chamber with a top, a bottom, and a sidewall coupled together to define an enclosure, a gas distributor around the sidewall, a substrate support disposed in the enclosure, the substrate support having a central opening and a plurality of substrate locations distributed around the central opening, a pumping port below the substrate support, and an energy source coupled to the top or the bottom. The energy source may be a radiant source, a thermal source, a UV source, or a plasma source. The substrate support may be rotated using a magnetic rotator and an air bearing. The gas distributor may have a plurality of passages distributed around a circumference of the gas distributor.

    摘要翻译: 本公开的实施例提供一种处理室,其具有联接在一起以限定外壳的顶部,底部和侧壁,围绕侧壁的气体分布器,设置在外壳中的基板支撑件,基板支撑件具有中心开口和 围绕中心开口分布的多个基板位置,在基板支撑件下方的泵送端口以及耦合到顶部或底部的能量源。 能源可以是辐射源,热源,UV源或等离子体源。 可以使用磁性旋转器和空气轴承来旋转衬底支撑件。 气体分配器可以具有围绕气体分配器的圆周分布的多个通道。

    SYSTEM AND METHOD FOR ALL WRAP AROUND POROUS SILICON FORMATION
    10.
    发明申请
    SYSTEM AND METHOD FOR ALL WRAP AROUND POROUS SILICON FORMATION 审中-公开
    用于所有缠绕多孔硅形成的系统和方法

    公开(公告)号:WO2016094271A1

    公开(公告)日:2016-06-16

    申请号:PCT/US2015/064194

    申请日:2015-12-07

    摘要: Methods and systems for all wrap around porous silicon formation are provided herein. In some embodiments, a substrate holder used for all wrap around porous silicon formation may include a body having a tapered opening along a first edge of the body, wherein the tapered opening is configured to release byproduct gases produced during porous silicon formation on a substrate supported by the substrate holder, a first vacuum channel formed in the body and extending to a first surface of the body, and a first sealing element disposed on the first surface of the body and fluidly coupled to the first vacuum channel, where in the first sealing element supports the substrate when disposed thereon.

    摘要翻译: 本文提供了所有环绕多孔硅形成的方法和系统。 在一些实施例中,用于全部包裹多孔硅结构的衬底保持器可以包括具有沿着主体的第一边缘的锥形开口的本体,其中锥形开口被配置为释放在支撑的衬底上的多孔硅形成期间产生的副产物气体 通过所述衬底保持器,形成在所述主体中并延伸到所述主体的第一表面的第一真空通道以及设置在所述主体的所述第一表面上并且流体耦合到所述第一真空通道的第一密封元件,其中在所述第一密封 元件在其上布置时支撑基板。