公开(公告)号：WO2023069463A1

公开(公告)日：2023-04-27

申请号：PCT/US2022/047055

申请日：2022-10-18

Applicant: LAM RESEARCH CORPORATION

Inventor： THAULAD, Peter S. ,  HERZIG, Brett M. ,  GENETTI, Damon Tyrone ,  REINS, Charles Byron

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/67 ,  B25J11/00 ,  B25J9/16 ,  B25J15/00

Abstract: Apparatuses and methods for assisting in the calibration of a wafer-handling robot for a semiconductor processing tool are provided herein. Some embodiments include a calibration wafer having a nominally circular disk shape having an outer edge with a nominal diameter of 200mm ± 1mm, 300mm ± 1mm, or 450mm ± 1mm, two or more cutouts arranged along the outer edge, and a plurality of fiducial markers, in which each cutout is at least partially defined by one or more edges, each cutout extends radially inwards at least 2mm from a reference circle defined by the outer edge, and one or more fiducial markers are adjacent to each cutout.

公开(公告)号：WO2021022291A1

公开(公告)日：2021-02-04

申请号：PCT/US2020/070300

申请日：2020-07-21

Applicant: LAM RESEARCH CORPORATION

Inventor： SADEGHI, Hossein ,  BLANK, Richard M. ,  THAULAD, Peter S. ,  EMERSON, Mark E. ,  JEYAPALAN, Arulselvam Simon

IPC: H01L21/68 ,  B25J9/16 ,  H01L21/677 ,  H01L21/67

Abstract: Systems and techniques for determining and using multiple types of offsets for providing wafers to a wafer support of a wafer station of a semiconductor processing tool are disclosed; such techniques and systems may use an autocalibration wafer that may include a plurality of sensors, including a plurality of edge-located imaging sensors that may be used to image fiducials associated with two different structures located in a selected wafer station.

公开(公告)号：WO2020096864A1

公开(公告)日：2020-05-14

申请号：PCT/US2019/059261

申请日：2019-10-31

Applicant: LAM RESEARCH CORPORATION

Inventor： THAULAD, Peter S. ,  HERZIG, Brett M. ,  BLANK, Richard M. ,  MOORING, Benjamin W.

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/673

Abstract: Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot are discussed. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.