公开(公告)号：WO2023080925A1

公开(公告)日：2023-05-11

申请号：PCT/US2022/025474

申请日：2022-04-20

申请人： LEDVANCE LLC

发明人： WANG, Xinrong ,  JIANG, Tianzheng ,  LI, Ming

IPC分类号： H01L33/50 ,  H01L27/15 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/48 ,  H01L33/62 ,  H01L23/14 ,  H01L33/00

摘要： A light emitting diode (LED) structure (50) that includes a stent substrate (60); and a circuit (54) having a plurality of contact pads arranged along a length of the stent substrate (60). The structure further includes a plurality of light emitting diode (LED) chips (50), wherein each light emitting diode chip (50) in the plurality of chips is engaged to a set of contact pads along the length of the metal stent substrate (60). A continuous phosphor layer (53) is present overlying the plurality of light emitting diode (LED) chips (50), the continuous phosphor layer (53) including first portions that are in direct contact with at least a light transmission surface of the light emitting diode (LED) chips (50) and second portions that bridge across the space separating adjacently positioned light emitting diode.

公开(公告)号：WO2023080929A1

公开(公告)日：2023-05-11

申请号：PCT/US2022/029954

申请日：2022-05-19

申请人： LEDVANCE LLC

发明人： WANG, Xinrong ,  JIANG, Tianzheng ,  LI, Ming

IPC分类号： F21K9/238 ,  F21K9/232 ,  F21K9/237 ,  F21K9/64 ,  F21Y107/00

摘要： A lamp including electrical leads (56a, 56b) extending into a supporting stem (25) that are in communication with a base electrode (66) for engagement to a light fixture; and a light engine comprising light emitting diode filaments (100a, 100b, 100c, 100d, 100c, 100f) that are in electrical communication with the electrical leads. The light emitting diode filaments further include light emitting diode (LED) chips engaged to contact pads of a circuit on a substrate to provide that the light emitting diode (LED) chips (150) are electrically connected. In some embodiments, each light emitting diode (LED) chip includes at least a light transmission surface that is in contact with an individual portion of phosphor (153) for the LED chip. In other embodiments, a phosphor layer (253) extends over an island of LED chips.