公开(公告)号：WO2021102076A1

公开(公告)日：2021-05-27

申请号：PCT/US2020/061169

申请日：2020-11-19

Applicant: LIGHTMATTER, INC.

Inventor： HARRIS, Nicholas, C. ,  GOULD, Michael ,  TYMCHENKO, Mykhailo ,  GAO, Weilu ,  GUPTA, Shashank

IPC: G02F1/17 ,  G02F1/21

Abstract: The techniques described herein relate to methods and apparatus for interferometric modulation. An apparatus includes an interferometric device comprising a first optical path and a second optical path, and at least one Franz-Keldysh (FK) modulator disposed in either the first optical path or the second optical path of the interferometric device. The interferometric device receives input light, wherein a first portion of the input light travels along the first optical path of the interferometric device, and a second portion of the input light travels along the second optical path of the interferometric device. The FK modulator modulates an intensity of either the first portion of the input light or the second portion of the input light.

公开(公告)号：WO2020181097A1

公开(公告)日：2020-09-10

申请号：PCT/US2020/021209

申请日：2020-03-05

Applicant: LIGHTMATTER, INC.

Inventor： HARRIS, Nicholas C. ,  RAMEY, Carl ,  GOULD, Michael ,  GRAHAM, Thomas ,  BUNANDAR, Darius ,  BRAID, Ryan ,  TYMCHENKO, Mykhailo

IPC: H04B10/80 ,  G02B6/122 ,  G02B6/125 ,  G02B6/136 ,  G02B6/42 ,  H04J14/02

Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.