公开(公告)号：WO2004020209A1

公开(公告)日：2004-03-11

申请号：PCT/JP2003/010384

申请日：2003-08-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： OTAKE, Yuji ,  MIYAHARA, Seiichi ,  MAEDA, Akira ,  MANTANI, Masayuki

IPC: B41M1/12

CPC classification number: B41M3/006 ,  B41F15/26 ,  B41M1/12 ,  H05K3/1233 ,  H05K2203/0264 ,  H05K2203/1492

Abstract: In a screen printing method of bringing a mask plate into contact with a substrate to print solder cream through a pattern hole on the substrate, a plate separating operation of separating the substrate from the mask plate after a squeegeeing step in which the solder cream is filled into the pattern hole comprises an operationpatternin.which acceleration and deceleration pattern in which a descending speed is accelerated up to an upper limit speed and thereafter decelerated up to a lower limit speed is repeated plural times. Further, an initial upper limit speed in start of the plate separating operation is set higher than the succeeding upper limit speeds, whereby viscosity of the solder cream into the pattern hole in start of the plate separating operation is lowered, and the mask plate can be separated with a high accuracy throughout the entire range of the substrate.

Abstract translation: 在使掩模板与基板接触以通过基板上的图案孔印刷焊膏的丝网印刷方法中，在填充有焊膏的刮板步骤之后，将基板与掩模板分离的板分离操作 图案孔包括操作画面，其中下降速度加速到上限速度，然后减速到下限速度的加速和减速模式被重复多次。 此外，将板分离操作开始时的初始上限速度设定为高于随后的上限速度，由此降低了板分离操作开始时焊料膏到图案孔中的粘度，并且掩模板可以 在基板的整个范围内以高精度分离。

公开(公告)号：WO2005009733A1

公开(公告)日：2005-02-03

申请号：PCT/JP2004/011109

申请日：2004-07-28

Applicant: Matsushita Electric Industrial Co., Ltd. ,  MIYAHARA, Seiichi ,  TANAKA, Tetsuya ,  OOTAKE, Yuji ,  SAKAI, Tamotsu ,  MANTANI, Masayuki

Inventor： MIYAHARA, Seiichi ,  TANAKA, Tetsuya ,  OOTAKE, Yuji ,  SAKAI, Tamotsu ,  MANTANI, Masayuki

IPC: B41F15/08

CPC classification number: H05K3/1233 ,  H05K3/3484 ,  H05K2203/1105 ,  H05K2203/163

Abstract: In a screen printing apparatus which prints solder cream on a substrate by a closed type squeeze head, in print space 35 that houses the solder cream 5 pressurized in a paste storing part and brings the solder cream 5 into contact with a surface of a mask plate, a hollow heat regulating member 37 provided in a horizontal direction orthogonal to a squeezing direction is caused to pass, and a heat regulating medium is circulated inside the heat regulating member 37 by a heat regulator 40, whereby the solder cream 5 in the print space 35 can be always kept at an appropriate temperature and at an appropriate viscosity, so that print quality can be secured.

Abstract translation: 在通过封闭式挤压头在基板上印刷焊膏的丝网印刷装置中，在印刷空间35中，该印刷空间35容纳在浆料储存部分中加压的焊膏5并使焊膏5与掩模板的表面接触 使与热挤压方向正交的水平方向设置的中空热调节部件37通过，并且通过热调节器40在热量调节部件37的内部循环调节热介质，由此在打印空间 35可以始终保持在适当的温度和适当的粘度，从而可以确保打印质量。