公开(公告)号：WO2021195512A1

公开(公告)日：2021-09-30

申请号：PCT/US2021/024382

申请日：2021-03-26

Applicant: MENLO MICROSYSTEMS, INC.

Inventor： MINNICK, Andrew ,  KEIMEL, Christopher, F. ,  ZHU, Xu

IPC: B81B7/00 ,  B81C1/00 ,  B81B2201/014 ,  B81B7/0041 ,  B81C1/0015 ,  B81C1/00166 ,  B81C1/00182 ,  B81C1/00293 ,  H01H1/0237 ,  H01H2001/0052 ,  H01H49/00 ,  H01H59/0009 ,  H01L21/00

Abstract: A method of fabricating and packaging an ohmic micro-electro-mechanical system (MEMS) switch device may comprise constructing the switch device on an insulating substrate. The switch device may have contacts that consist of a platinum- group metal. The method may further comprise forming an oxidized layer of the platinum-group metal on an outer surface of each of the one or more contacts. The method may further comprise bonding an insulating cap to the insulating substrate, to hermetically seal the switch device. The bonding may occur in an atmosphere that has a proportion of oxygen within a range of 0.5% to 30%, such that, after the switch device has been hermetically sealed within the sealed cavity, an atmosphere within the sealed cavity has a proportion of oxygen within the range of 0.5% to 30%. The platinum-group metal may be ruthenium, and the oxidized layer of the platinum-group metal may be ruthenium dioxide.

公开(公告)号：WO2020171821A1

公开(公告)日：2020-08-27

申请号：PCT/US2019/019160

申请日：2019-02-22

Applicant: MENLO MICROSYSTEMS, INC.

Inventor： ZHU, Xu ,  EVANS, Darryl ,  KEIMEL, Chris

IPC: B81B7/00 ,  B81C1/00 ,  H01H1/00

Abstract: A hermetically sealed component may comprise a glass substrate, a device with at least one electrical port associated with the glass substrate, and a glass cap. The glass cap may have at least one side wall. The glass cap may have a shaped void extending therethrough, from top surface of the glass cap to bottom surface of glass pillar. An electrically conductive plug may be disposed within the void, the plug configured to hermetically seal the void. The electrically conductive plug may be electrically coupled to the electrical port. The glass cap may be disposed on the glass substrate, with the at least one side wall disposed therebetween, to form a cavity encompassing the device. The side wall may contact the glass substrate and the glass cap to provide a hermetic seal, such that a first environment within the cavity is isolated from a second environment external to the cavity.