ELECTRONIC ASSEMBLY THAT INCLUDES INTERCONNECTED CIRCUIT BOARDS

    公开(公告)号:WO2022245495A1

    公开(公告)日:2022-11-24

    申请号:PCT/US2022/026424

    申请日:2022-04-27

    IPC分类号: H05K1/02 H05K1/14 H05K3/36

    摘要: An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.

    TWO WIRE POWER DELIVERY SYSTEM FOR MOBILE DEVICES WITH PASSIVE ORIENTATION DETECTION

    公开(公告)号:WO2023278033A1

    公开(公告)日:2023-01-05

    申请号:PCT/US2022/029720

    申请日:2022-05-18

    IPC分类号: H02J7/00

    摘要: Technologies are described herein for a two-wire power delivery system that may be employed by a mobile device with a reversable cable. The described techniques allow for the two-wire power cable to be inserted in any orientation into the mobile device, without requiring a special keying or registration element, and without requiring any additional pins or wires. The mobile device includes a passive protection circuit that assists the two-wire power cable system in detecting the correct orientation for power delivery.