公开(公告)号：WO2015080550A1

公开(公告)日：2015-06-04

申请号：PCT/MY2014/000118

申请日：2014-05-26

Applicant: MIMOS BERHAD

Inventor： ABD WAHID Khairul Anuar Bin ,  LEE, Wai Yee ,  Daniel BIEN Chia Sheng ,  ABD RASHID Amirul Bin

IPC: B81C1/00

CPC classification number: B81C1/00206 ,  B81B2201/0214 ,  B81C2201/0188

Abstract: A method of forming nanomaterials (10) on packaged sensor- device platform, the method comprising the steps of fabricating (11) a sensor device platform on full scale wafer to form a fully packaged sensor device platform for nanomaterials forming process (10) which comprises the steps of protecting the wire bond with epoxy while leaving the sensing area exposed for receiving coating of catalyst precursor for the nanomaterial growth, nucleating (1.6) the coated catalyst precursor at low temperature for forming an active nanoparticle, and providing the active nanoparticle nucleation with nutrient solution for turning them into solid and forming nanostructures for integration of readout circuit for sensing.

Abstract translation: 一种在封装的传感器装置平台上形成纳米材料（10）的方法，所述方法包括以下步骤：（11）在全尺寸晶片上制造（11）传感器装置平台，以形成用于纳米材料形成工艺（10）的完全封装的传感器装置平台，其包括 保护引线与环氧树脂的步骤，同时留下感测区域，以暴露出用于接纳纳米材料生长的催化剂前体的涂层，在低温下成核（1.6）涂覆的催化剂前体以形成活性纳米颗粒，并提供活性纳米颗粒成核 营养液将其转化为固体并形成纳米结构，用于集成用于感测的读出电路。