MICROELECTRONIC RF SUBSTRATE WITH AN INTEGRAL ISOLATOR/CIRCULATOR

    公开(公告)号:WO2019083689A1

    公开(公告)日:2019-05-02

    申请号:PCT/US2018/053711

    申请日:2018-10-01

    CPC classification number: H01P1/36 H01L27/04 H01P1/127 H01P1/38 H01P1/387

    Abstract: An exemplary electronic assembly includes a planar semiconductor substrate having a front side with semiconductor components and a back side that includes one recess extending inwardly. One of an isolator and circulator is formed as part of the planar semiconductor substrate and includes one magnetic ferrite disk mounted within the one recess within the thickness of the planar semiconductor substrate. The one of an isolator and circulator has at least input and output ports. The input port is disposed to receive a radio frequency signal to be coupled with low insertion loss to the output port while providing high insertion loss to other radio frequency signals attempting to propagate from the output port to the input port.

    INTEGRATED CIRCULATOR SYSTEM
    3.
    发明申请

    公开(公告)号:WO2021252132A1

    公开(公告)日:2021-12-16

    申请号:PCT/US2021/032406

    申请日:2021-05-14

    Abstract: One example includes an integrated circulator system comprising a junction. The junction includes a first port, a second port, and a third port. The junction also includes a substrate material layer on which the first, second, and third ports are provided. The junction also includes a magnetic material layer coupled to the substrate layer. The junction further includes a resonator coupled to the first, second, and third ports to provide signal transmission from the first port to the second port and from the second port to the third port based on a magnetic field provided by the magnetic material layer.

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